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- John_Bond_(physicist) abstract "John W. Bond (born 1956) is an English physicist. He developed a technique for lifting fingerprints off of metal years after they are left by virtue of the corrosion caused to the metal by the fingerprint sweat. He has several patented inventions related to metal corrosion. His invention was named a TIME'S magazine best invention of 2008. In 2011 he received an OBE in the Queen's Birthday Honours list for services to Forensic Science.".
- John_Bond_(physicist) birthDate "1956".
- John_Bond_(physicist) birthYear "1956".
- John_Bond_(physicist) wikiPageExternalLink drjohnbondfellow.html.
- John_Bond_(physicist) wikiPageExternalLink John_Bond_physicist.
- John_Bond_(physicist) wikiPageExternalLink 926.
- John_Bond_(physicist) wikiPageID "28236949".
- John_Bond_(physicist) wikiPageRevisionID "588880354".
- John_Bond_(physicist) dateOfBirth "1956".
- John_Bond_(physicist) hasPhotoCollection John_Bond_(physicist).
- John_Bond_(physicist) name "Bond, John W".
- John_Bond_(physicist) placeOfBirth "Northampton, England".
- John_Bond_(physicist) shortDescription "British physicist".
- John_Bond_(physicist) description "British physicist".
- John_Bond_(physicist) description "British physicist".
- John_Bond_(physicist) subject Category:1956_births.
- John_Bond_(physicist) subject Category:English_physicists.
- John_Bond_(physicist) subject Category:Living_people.
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- John_Bond_(physicist) comment "John W. Bond (born 1956) is an English physicist. He developed a technique for lifting fingerprints off of metal years after they are left by virtue of the corrosion caused to the metal by the fingerprint sweat. He has several patented inventions related to metal corrosion. His invention was named a TIME'S magazine best invention of 2008. In 2011 he received an OBE in the Queen's Birthday Honours list for services to Forensic Science.".
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- John_Bond_(physicist) givenName "John W".
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- John_Bond_(physicist) name "Bond, John W".
- John_Bond_(physicist) name "John W Bond".
- John_Bond_(physicist) surname "Bond".