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- Bond_characterization abstract "The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws. Those flaws can be caused by void formation in the interface due to unevenness or impurities. The bond connection is characterized for wafer bond development or quality assessment of fabricated wafers and sensors.".
- Bond_characterization thumbnail A-ir.png?width=300.
- Bond_characterization wikiPageID "31380244".
- Bond_characterization wikiPageRevisionID "603063575".
- Bond_characterization align "left".
- Bond_characterization caption "Schematic chevron notched specimen with cracked area according to Bagdahn.".
- Bond_characterization caption "Scheme of a chevron notched specimen.".
- Bond_characterization caption "Scheme of a chevron test setup.".
- Bond_characterization caption "Shear test with pressure providing top tool and bottom tool on movable skid with specimen .".
- Bond_characterization caption "Shear testing device.".
- Bond_characterization caption "Top and bottom tool with specimen .".
- Bond_characterization direction "horizontal".
- Bond_characterization hasPhotoCollection Bond_characterization.
- Bond_characterization header "Chevron test".
- Bond_characterization header "Shear test".
- Bond_characterization image "a-chevron1.png".
- Bond_characterization image "a-chevron2.png".
- Bond_characterization image "a-chevron3.png".
- Bond_characterization image "a-sheartest1.jpg".
- Bond_characterization image "a-sheartest2.jpg".
- Bond_characterization image "a-sheartest3.jpg".
- Bond_characterization width "300".
- Bond_characterization subject Category:Electronics_manufacturing.
- Bond_characterization subject Category:Microtechnology.
- Bond_characterization subject Category:Packaging_(microfabrication).
- Bond_characterization subject Category:Semiconductor_device_fabrication.
- Bond_characterization subject Category:Semiconductor_technology.
- Bond_characterization subject Category:Wafer_bonding.
- Bond_characterization comment "The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws. Those flaws can be caused by void formation in the interface due to unevenness or impurities. The bond connection is characterized for wafer bond development or quality assessment of fabricated wafers and sensors.".
- Bond_characterization label "Bond characterization".
- Bond_characterization sameAs m.0gkx9wh.
- Bond_characterization sameAs Q4941313.
- Bond_characterization sameAs Q4941313.
- Bond_characterization wasDerivedFrom Bond_characterization?oldid=603063575.
- Bond_characterization depiction A-ir.png.
- Bond_characterization isPrimaryTopicOf Bond_characterization.