Matches in DBpedia 2014 for { <http://dbpedia.org/resource/Die_(integrated_circuit)> ?p ?o. }
Showing items 1 to 47 of
47
with 100 items per page.
- Die_(integrated_circuit) abstract "A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.There are three commonly used plural forms: dice, dies, and die.".
- Die_(integrated_circuit) individualisedGnd "4197163-2".
- Die_(integrated_circuit) thumbnail Cell-Processor.jpg?width=300.
- Die_(integrated_circuit) wikiPageID "7736707".
- Die_(integrated_circuit) wikiPageRevisionID "599694701".
- Die_(integrated_circuit) gnd "4197163".
- Die_(integrated_circuit) hasPhotoCollection Die_(integrated_circuit).
- Die_(integrated_circuit) typ "s".
- Die_(integrated_circuit) subject Category:Integrated_circuits.
- Die_(integrated_circuit) type Artifact100021939.
- Die_(integrated_circuit) type Circuit103033362.
- Die_(integrated_circuit) type ComputerCircuit103084420.
- Die_(integrated_circuit) type Device103183080.
- Die_(integrated_circuit) type ElectricalDevice103269401.
- Die_(integrated_circuit) type Instrumentality103575240.
- Die_(integrated_circuit) type IntegratedCircuit103577090.
- Die_(integrated_circuit) type IntegratedCircuits.
- Die_(integrated_circuit) type Object100002684.
- Die_(integrated_circuit) type PhysicalEntity100001930.
- Die_(integrated_circuit) type Whole100003553.
- Die_(integrated_circuit) type Agent.
- Die_(integrated_circuit) type Agent.
- Die_(integrated_circuit) type Thing.
- Die_(integrated_circuit) comment "A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit.".
- Die_(integrated_circuit) label "Die (Halbleitertechnik)".
- Die_(integrated_circuit) label "Die (circuit intégré)".
- Die_(integrated_circuit) label "Die (circuito integrado)".
- Die_(integrated_circuit) label "Die (circuito integrado)".
- Die_(integrated_circuit) label "Die (elettronica)".
- Die_(integrated_circuit) label "Die (integrated circuit)".
- Die_(integrated_circuit) label "Microchip".
- Die_(integrated_circuit) label "Кристалл (микроэлектроника)".
- Die_(integrated_circuit) label "晶粒".
- Die_(integrated_circuit) sameAs Die_(Halbleitertechnik).
- Die_(integrated_circuit) sameAs Die_(circuito_integrado).
- Die_(integrated_circuit) sameAs Die_(circuit_intégré).
- Die_(integrated_circuit) sameAs Die_(elettronica).
- Die_(integrated_circuit) sameAs 다이_(집적_회로).
- Die_(integrated_circuit) sameAs Microchip.
- Die_(integrated_circuit) sameAs Die_(circuito_integrado).
- Die_(integrated_circuit) sameAs m.026bcl6.
- Die_(integrated_circuit) sameAs Q1072430.
- Die_(integrated_circuit) sameAs Q1072430.
- Die_(integrated_circuit) sameAs Die_(integrated_circuit).
- Die_(integrated_circuit) wasDerivedFrom Die_(integrated_circuit)?oldid=599694701.
- Die_(integrated_circuit) depiction Cell-Processor.jpg.
- Die_(integrated_circuit) isPrimaryTopicOf Die_(integrated_circuit).