Matches in DBpedia 2014 for { <http://dbpedia.org/resource/Die_preparation> ?p ?o. }
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- Die_preparation abstract "Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer mounting and wafer dicing.".
- Die_preparation thumbnail Mounted_wafer.jpg?width=300.
- Die_preparation wikiPageID "1048685".
- Die_preparation wikiPageRevisionID "543857645".
- Die_preparation hasPhotoCollection Die_preparation.
- Die_preparation subject Category:Semiconductor_device_fabrication.
- Die_preparation comment "Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer mounting and wafer dicing.".
- Die_preparation label "Die preparation".
- Die_preparation label "ダイシング".
- Die_preparation sameAs ダイシング.
- Die_preparation sameAs m.041hbb.
- Die_preparation sameAs Q5274495.
- Die_preparation sameAs Q5274495.
- Die_preparation wasDerivedFrom Die_preparation?oldid=543857645.
- Die_preparation depiction Mounted_wafer.jpg.
- Die_preparation isPrimaryTopicOf Die_preparation.