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- 00701384 alternative "InterPACK '99".
- 00701384 contributor B286900.
- 00701384 contributor B286901.
- 00701384 contributor B286902.
- 00701384 created "c1999.".
- 00701384 date "1999".
- 00701384 date "c1999.".
- 00701384 dateCopyrighted "c1999.".
- 00701384 description "Includes bibliographic references and author index.".
- 00701384 extent "2 v. :".
- 00701384 identifier "0791816125".
- 00701384 isPartOf "EEP (Series) ; vol. 26.".
- 00701384 isPartOf "EEP, 1524-9425 ; vol. 26".
- 00701384 issued "1999".
- 00701384 issued "c1999.".
- 00701384 language "eng".
- 00701384 publisher "New York, N.Y. : American Society of Mechanical Engineers,".
- 00701384 subject "621.381/046 21".
- 00701384 subject "Electronic packaging Congresses.".
- 00701384 subject "TK7870.15 .P33 1999".
- 00701384 title "Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee.".
- 00701384 title "InterPACK '99".
- 00701384 type "text".