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- 2001092109 alternative "Advances in electronic materials and packaging 2001".
- 2001092109 contributor B8970368.
- 2001092109 contributor B8970369.
- 2001092109 contributor B8970370.
- 2001092109 created "c2001.".
- 2001092109 date "2001".
- 2001092109 date "c2001.".
- 2001092109 dateCopyrighted "c2001.".
- 2001092109 description "Includes bibliographical references and index.".
- 2001092109 extent "xviii, 449 p. :".
- 2001092109 identifier "0780371577 (pbk.)".
- 2001092109 issued "2001".
- 2001092109 issued "c2001.".
- 2001092109 language "eng".
- 2001092109 publisher "Piscataway, NJ : IEEE,".
- 2001092109 subject "621.381/046 22".
- 2001092109 subject "Electronic packaging Congresses.".
- 2001092109 subject "Electronics Materials Congresses.".
- 2001092109 subject "TK7871 .I588 2001".
- 2001092109 title "Advances in electronic materials and packaging 2001".
- 2001092109 title "Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001 : November 19-22, 2001, Jeju Island, Korea / organized by Korea Advanced Institute of Science & Technology, CARE (Computer Aided Reliablity Evaluation Packaging) National Research Laboratory, Center for Electronic Packaging Materials (CEPM) ; in collaboration with Institute of Electrical and Electronics Engineers, IEEE Component, Packaging & Manufacturing Technology ; [S.B. Lee and K.W. Paik, editors].".
- 2001092109 type "text".