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- 2002022134 contributor B9215038.
- 2002022134 created "c2002.".
- 2002022134 date "2002".
- 2002022134 date "c2002.".
- 2002022134 dateCopyrighted "c2002.".
- 2002022134 description "Includes bibliographical references and index.".
- 2002022134 description "Machine generated contents note: NEW INSTRUMENTATION 1. Surface Analysis Using Confocal Raman Micro-spectroscopy C. Hyett, D.-Q. Yang, T.H. Ellis, and E. Sacher 2. Ellipsometric Characterization of the Optical Constants of Metals: Thin Film versus Nanoparticle D. Dalacu and L. Martinu 3. Ultra Thin Film Analysis Using the Thermo VG Scientifics Thetaprobe Instrument R.K. Champaneria and J. Wolstenholme 4. Nanoindentation of Microsprings and Microcantilevers M. Seto, B. Dick, and M. Brett LOW PERMITTIVITY MATERIALS 5. Physical and Interfacial Properties of Low Permittivity Polymers: Cyclotene, SiLK and Ultra-Low K D. Frye, J.J. Waeterloos, M. Simmonds, T. Stokich, and J. Im 6. Mechanical Properties of Cured Silk Low-K Dielectric Films J. Im, P.H. Townsend, J. Curphy, C. Karas, and E.O. Shaffer II 7. Plasma-Polymerized Fluoropolymer Thin Films for Microelectronic Applications M. Silverstein, R. Chen, E. Sacher, and L. Sandrin POLYMER METALLIZATION 8. Fundamental Aspects of Polymer Metallization F. Faupel, V. Zaporojtchenko, T. Strunskus, J. Erichsen, K. Dolgner, A. Thran, and M. Keine 9. The Study of Copper Clusters on Dow Cyclotene and Their Stability D.-Q. Yang and E. Sacher 10. Adsorption of Noble Metal Atoms on Polymers V. Zaporojtchenko, J. Erichsen, J. Zekonyte, A. Thran, T. Strunskus, and F. Faupel 11. Nucleation and Growth of Vapor-Deposited Metal Films on Self-Assembled Monolayers Studied by Multiple Characterization Probes A.V. Walker, G.L. Fisher, A.E. Hooper, T. Tighe, R. Opila, N. Winograd, and D.L. Allara BARRIER LAYERS 12. Morphological Investigations of Low-k Polymer/Diffusion Barrier Interfaces for IC Metallization S. Sankaran and R.E. Geer 13. Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics P. Abramowitz, J. Liu, M. Keine, P.S. Ho, and J. Im 14. Capabilities and Limitations of RBS to Characterize Hyper-Thin Silicon Compound on Various Polymeric Substrates G. Dennler, A. Houdayer, P. Raynaud, Y. Segui, and M.R. Wertheimer ADHESION ENHANCEMENT 15. Surface Modifications by Ion-Assisted Reactions S.K. Koh, J.S. Cho, S. Han, K.H. Kim, and Y.W. Beag 16. Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Enhancement of Electrolessly Deposited Ni or Cu Films M. Romand, M. Charbonnier and, Y. Goepfert.".
- 2002022134 extent "viii, 208 p. :".
- 2002022134 identifier "0306472538".
- 2002022134 identifier 2002022134-d.html.
- 2002022134 identifier 2002022134.html.
- 2002022134 issued "2002".
- 2002022134 issued "c2002.".
- 2002022134 language "eng".
- 2002022134 publisher "New York : Kluwer Academic/Plenum Publishers,".
- 2002022134 subject "668.9 21".
- 2002022134 subject "Metal coating Congresses.".
- 2002022134 subject "Metallizing Congresses.".
- 2002022134 subject "Polymers Surfaces Congresses.".
- 2002022134 subject "TA491 .M463 2002".
- 2002022134 tableOfContents "Machine generated contents note: NEW INSTRUMENTATION 1. Surface Analysis Using Confocal Raman Micro-spectroscopy C. Hyett, D.-Q. Yang, T.H. Ellis, and E. Sacher 2. Ellipsometric Characterization of the Optical Constants of Metals: Thin Film versus Nanoparticle D. Dalacu and L. Martinu 3. Ultra Thin Film Analysis Using the Thermo VG Scientifics Thetaprobe Instrument R.K. Champaneria and J. Wolstenholme 4. Nanoindentation of Microsprings and Microcantilevers M. Seto, B. Dick, and M. Brett LOW PERMITTIVITY MATERIALS 5. Physical and Interfacial Properties of Low Permittivity Polymers: Cyclotene, SiLK and Ultra-Low K D. Frye, J.J. Waeterloos, M. Simmonds, T. Stokich, and J. Im 6. Mechanical Properties of Cured Silk Low-K Dielectric Films J. Im, P.H. Townsend, J. Curphy, C. Karas, and E.O. Shaffer II 7. Plasma-Polymerized Fluoropolymer Thin Films for Microelectronic Applications M. Silverstein, R. Chen, E. Sacher, and L. Sandrin POLYMER METALLIZATION 8. Fundamental Aspects of Polymer Metallization F. Faupel, V. Zaporojtchenko, T. Strunskus, J. Erichsen, K. Dolgner, A. Thran, and M. Keine 9. The Study of Copper Clusters on Dow Cyclotene and Their Stability D.-Q. Yang and E. Sacher 10. Adsorption of Noble Metal Atoms on Polymers V. Zaporojtchenko, J. Erichsen, J. Zekonyte, A. Thran, T. Strunskus, and F. Faupel 11. Nucleation and Growth of Vapor-Deposited Metal Films on Self-Assembled Monolayers Studied by Multiple Characterization Probes A.V. Walker, G.L. Fisher, A.E. Hooper, T. Tighe, R. Opila, N. Winograd, and D.L. Allara BARRIER LAYERS 12. Morphological Investigations of Low-k Polymer/Diffusion Barrier Interfaces for IC Metallization S. Sankaran and R.E. Geer 13. Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics P. Abramowitz, J. Liu, M. Keine, P.S. Ho, and J. Im 14. Capabilities and Limitations of RBS to Characterize Hyper-Thin Silicon Compound on Various Polymeric Substrates G. Dennler, A. Houdayer, P. Raynaud, Y. Segui, and M.R. Wertheimer ADHESION ENHANCEMENT 15. Surface Modifications by Ion-Assisted Reactions S.K. Koh, J.S. Cho, S. Han, K.H. Kim, and Y.W. Beag 16. Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Enhancement of Electrolessly Deposited Ni or Cu Films M. Romand, M. Charbonnier and, Y. Goepfert.".
- 2002022134 title "Metallization of polymers 2 / edited by Edward Sacher.".
- 2002022134 type "text".