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- 2011934923 contributor B12420542.
- 2011934923 created "c2011".
- 2011934923 date "2011".
- 2011934923 date "c2011".
- 2011934923 dateCopyrighted "c2011".
- 2011934923 description "Includes bibliographical references and index.".
- 2011934923 description "Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.".
- 2011934923 extent "xiii, 340 p. :".
- 2011934923 identifier "1845699378 (hbk.)".
- 2011934923 identifier "9780857093752 (online)".
- 2011934923 identifier "9781845699376 (hbk.)".
- 2011934923 identifier 2011934923-b.html.
- 2011934923 identifier 2011934923-d.html.
- 2011934923 identifier 2011934923-t.html.
- 2011934923 isPartOf "Woodhead Publishing in materials".
- 2011934923 isPartOf "Woodhead Publishing in materials.".
- 2011934923 issued "2011".
- 2011934923 issued "c2011".
- 2011934923 language "eng".
- 2011934923 publisher "Oxford ; Philadelphia : Woodhead Publishing,".
- 2011934923 subject "Electrodiffusion.".
- 2011934923 subject "Integrated circuits Deterioration.".
- 2011934923 subject "Interconnects (Integrated circuit technology)".
- 2011934923 subject "TK7874 .E478 2011".
- 2011934923 subject "Thin films.".
- 2011934923 tableOfContents "Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.".
- 2011934923 title "Electromigration in thin films and electronic devices : materials and reliability / edited by Choong-Un Kim.".
- 2011934923 type "text".