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- 01HSB63QZ6RYJXVF75F4CC878D classification P1.
- 01HSB63QZ6RYJXVF75F4CC878D date "2024".
- 01HSB63QZ6RYJXVF75F4CC878D language "eng".
- 01HSB63QZ6RYJXVF75F4CC878D type conference.
- 01HSB63QZ6RYJXVF75F4CC878D hasPart 01HSB668QTHE2F3A7TCDZCP3VR.pdf.
- 01HSB63QZ6RYJXVF75F4CC878D hasPart 01HSB66ENJECK59XZMK3D2YE78.pdf.
- 01HSB63QZ6RYJXVF75F4CC878D subject "Technology and Engineering".
- 01HSB63QZ6RYJXVF75F4CC878D doi "10.1117/12.3000934".
- 01HSB63QZ6RYJXVF75F4CC878D isbn "9781510670457".
- 01HSB63QZ6RYJXVF75F4CC878D issn "0277-786X".
- 01HSB63QZ6RYJXVF75F4CC878D issn "1996-756X".
- 01HSB63QZ6RYJXVF75F4CC878D presentedAt urn:uuid:2b89304f-69e9-4999-babc-dbd2f11a152f.
- 01HSB63QZ6RYJXVF75F4CC878D volume "12892".
- 01HSB63QZ6RYJXVF75F4CC878D abstract "Commercial introduction of emerging integrated photonics technologies requires a long and complex multi-layer product development, industrialization, and qualification cycles at all levels of value chain from initial product design, material sourcing, component-system-module manufacturing, and testing, through marketing and delivery of new products to the market. Scalable assembly and packaging of electronic-photonic integrated modules is important and may take more than a half of the entire product’s costs. In this paper, we will report on some of our industrial processes for scalable photonics packaging, as well as challenges and results obtained from our research and innovation projects.".
- 01HSB63QZ6RYJXVF75F4CC878D author F5F8186E-F0ED-11E1-A9DE-61C894A0A6B4.
- 01HSB63QZ6RYJXVF75F4CC878D author F6A9A020-F0ED-11E1-A9DE-61C894A0A6B4.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:143e5486-5b41-4101-b2d5-dc50290dbd1a.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:24128579-09e5-4bf3-a739-2f08067c53d6.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:2800f900-84e3-4c58-932d-65b4e03e41f3.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:3ddeb9e6-fe27-4051-b029-4715a37b9ff5.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:4816dc1f-9e68-47c8-bf39-ecd38d11364e.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:6dce5b76-3a6a-4c91-bba8-a6e4997cf299.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:6f8f34ce-4d6c-4b31-8922-9b9af7bb66be.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:8094e9d0-489c-4c58-bec3-96f560bf888e.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:9fc004d5-838a-419f-80e9-0e332b754823.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:bd83288c-a42f-450c-ab95-42262083d70b.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:d743e3e3-07d2-4b77-abdc-5b150bd403fe.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:e3dbb262-a160-447b-ad63-5f1f7d14b461.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:f39e1a39-cc71-49e1-b98a-f0c2690542c8.
- 01HSB63QZ6RYJXVF75F4CC878D author urn:uuid:f9a07e3d-e698-40cc-bc38-98a3df6e7bfc.
- 01HSB63QZ6RYJXVF75F4CC878D dateCreated "2024-03-19T11:03:58Z".
- 01HSB63QZ6RYJXVF75F4CC878D dateModified "2024-07-09T15:59:32Z".
- 01HSB63QZ6RYJXVF75F4CC878D editor urn:uuid:3d6471af-c380-4267-af11-c67d980b29c6.
- 01HSB63QZ6RYJXVF75F4CC878D editor urn:uuid:9478e9b7-16e6-412a-875f-19b1dec5a6eb.
- 01HSB63QZ6RYJXVF75F4CC878D name "Industrial photonics packaging for high volume applications".
- 01HSB63QZ6RYJXVF75F4CC878D pagination urn:uuid:1c0bd23e-6e27-4553-a002-72a0a1c1a5fc.
- 01HSB63QZ6RYJXVF75F4CC878D publisher urn:uuid:770616c4-4f4d-4096-adf7-642d7b91a2da.
- 01HSB63QZ6RYJXVF75F4CC878D sameAs LU-01HSB63QZ6RYJXVF75F4CC878D.
- 01HSB63QZ6RYJXVF75F4CC878D sourceOrganization urn:uuid:555c2d21-6029-4bca-b710-b2b2e321671d.
- 01HSB63QZ6RYJXVF75F4CC878D sourceOrganization urn:uuid:5a29de2a-485c-477b-aca6-eb95f6565fb7.
- 01HSB63QZ6RYJXVF75F4CC878D type P1.