Matches in UGent Biblio for { <https://biblio.ugent.be/publication/1845237#aggregation> ?p ?o. }
Showing items 1 to 43 of
43
with 100 items per page.
- aggregation classification "A1".
- aggregation creator B337200.
- aggregation creator B337201.
- aggregation creator B337202.
- aggregation creator B337203.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation date "2011".
- aggregation format "application/pdf".
- aggregation hasFormat 1845237.bibtex.
- aggregation hasFormat 1845237.csv.
- aggregation hasFormat 1845237.dc.
- aggregation hasFormat 1845237.didl.
- aggregation hasFormat 1845237.doc.
- aggregation hasFormat 1845237.json.
- aggregation hasFormat 1845237.mets.
- aggregation hasFormat 1845237.mods.
- aggregation hasFormat 1845237.rdf.
- aggregation hasFormat 1845237.ris.
- aggregation hasFormat 1845237.txt.
- aggregation hasFormat 1845237.xls.
- aggregation hasFormat 1845237.yaml.
- aggregation isPartOf urn:issn:1077-260X.
- aggregation language "eng".
- aggregation rights "I have transferred the copyright for this publication to the publisher".
- aggregation subject "Technology and Engineering".
- aggregation title "Ultrathin optoelectronic device packaging in flexible carriers".
- aggregation abstract "This paper presents the development of an advanced packaging technique for commercially available optoelectronic devices. Vertical Cavity Surface Emitting Laser diodes and Photodiodes are thinned down to 20 µm thickness, and are embedded in flexible carriers, resulting in a 75 µm thin package, which can be bent down to a bending radius of 2 mm. Electrical, optical and mechanical characterization addresses the influence of thinning and embedding of bare optoelectronic chips on their main properties. Next to the embedded optoelectronics, also electrical Integrated Circuits like amplifiers and drivers can be housed in the same thin flexible package, using an identical technology and layer build-up. Finally, this new packaging approach is demonstrated in two different integrated sensor applications and in an integrated optical interconnection. For the latter application, also waveguides and optical out-of-plane coupling elements are integrated in the package and the complete system reliability is assessed by accelerated aging tests.".
- aggregation authorList BK633171.
- aggregation endPage "628".
- aggregation issue "3".
- aggregation startPage "617".
- aggregation volume "17".
- aggregation aggregates 3145743.
- aggregation isDescribedBy 1845237.
- aggregation similarTo JSTQE.2010.2096407.
- aggregation similarTo LU-1845237.