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- aggregation classification "C3".
- aggregation creator B117143.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation date "2011".
- aggregation format "application/pdf".
- aggregation hasFormat 1860223.bibtex.
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- aggregation language "eng".
- aggregation rights "I have transferred the copyright for this publication to the publisher".
- aggregation subject "Chemistry".
- aggregation title "Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper".
- aggregation abstract "The rapid evolution of microelectronics industry translates itself into a need for higher density substrates with smaller features. In order to fulfill these requirements, one has to minimize the roughness treatment for dielectric materials (to avoid high frequency losses due to skin effect in the conductor).1, 2 Since surface roughness is one of the key treatments for the improvement of adhesion, chemical surface modification can (over)compensate this loss of adhesion.3, 4 In 2006, Messerschmitt et. al deposited a bio-inspired multifunctional polydopamine coating on a variety of substrates.5 Promising results were obtained concerning adhesion towards metals and biomacromolecules. Here, the surface of an epoxy resin is modified with a polydopamine layer to improve adhesion with electroless copper. A profound surface analysis of polydopamine modified epoxy resin surfaces is presented. Next, the influence of this modification strategy on the adhesion of electroless deposited copper is discussed. Finally, correlations between the adhesion strength and interface analysis are commented.".
- aggregation authorList BK301295.
- aggregation endPage "18".
- aggregation startPage "18".
- aggregation aggregates 3146226.
- aggregation isDescribedBy 1860223.
- aggregation similarTo LU-1860223.