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- aggregation classification "A1".
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- aggregation date "2006".
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- aggregation isPartOf urn:issn:0169-4332.
- aggregation language "eng".
- aggregation publisher "Elsevier Science".
- aggregation subject "Technology and Engineering".
- aggregation title "Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers".
- aggregation authorList BK625538.
- aggregation endPage "2740".
- aggregation issue "8".
- aggregation startPage "2717".
- aggregation volume "252".
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