Matches in UGent Biblio for { <https://biblio.ugent.be/publication/416984#aggregation> ?p ?o. }
Showing items 1 to 36 of
36
with 100 items per page.
- aggregation classification "P1".
- aggregation creator B66598.
- aggregation creator B66599.
- aggregation creator B66600.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation creator person.
- aggregation date "2007".
- aggregation hasFormat 416984.bibtex.
- aggregation hasFormat 416984.csv.
- aggregation hasFormat 416984.dc.
- aggregation hasFormat 416984.didl.
- aggregation hasFormat 416984.doc.
- aggregation hasFormat 416984.json.
- aggregation hasFormat 416984.mets.
- aggregation hasFormat 416984.mods.
- aggregation hasFormat 416984.rdf.
- aggregation hasFormat 416984.ris.
- aggregation hasFormat 416984.txt.
- aggregation hasFormat 416984.xls.
- aggregation hasFormat 416984.yaml.
- aggregation isPartOf urn:isbn:9781424407873.
- aggregation isPartOf urn:issn:1094-687X.
- aggregation language "eng".
- aggregation publisher "IEEE".
- aggregation subject "Technology and Engineering".
- aggregation title "Low cost, biocompatible elastic and conformable electronic technologies using MID in stretchable polymer".
- aggregation abstract "For user comfort reasons, electronic circuits for implantation in the human body or for use as smart clothes should ideally be soft, stretchable and elastic. In this contribution the results of an MUD (Molded Interconnect Device) technology will be presented, showing the feasibility of functional stretchable electronic circuits. In the developed technology rigid or flexible standard components are interconnected by meander shaped metallic wires and embedded by molding in a stretchable substrate polymer. Several technologies have been developed to this purpose, which combine low cost and good reliability under mechanical strain. In this way reliable stretchability of the circuits above 100% has been demonstrated. Enhanced reliability has been reached using an additional conductive polymer layer.".
- aggregation authorList BK168024.
- aggregation endPage "6596".
- aggregation startPage "6593".
- aggregation isDescribedBy 416984.
- aggregation similarTo LU-416984.