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- aggregation classification "C3".
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- aggregation date "2013".
- aggregation hasFormat 4217585.bibtex.
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- aggregation hasFormat 4217585.yaml.
- aggregation language "eng".
- aggregation subject "Technology and Engineering".
- aggregation title "Highly flexible, low loss feed structure for active wearable aperture coupled antennas with radically trimmed substrate".
- aggregation abstract "In an effort to improve the flexibility of active wearable aperture coupled patch antennas applied in smart textile systems, a laser shaping technique for the antenna feed substrate is presented. The technique consists of cutting away most of the antenna feed substrate, up to very close distances to the microstrip interconnects and in close vicinity to the coupling slots in the antenna ground plane. One the one hand, this changes the effective dielectric constant of the substrate, influencing the performance of the impedance-controlled designed RF circuitry, and the aperture coupling between the feed lines and the radiating structure. On the other hand, the removal of lossy, textile substrate material surrounding the RF interconnections reduces losses in the feed circuit. By taking this altered substrate into account during the design stage, high performance, light-weight and flexible active wearable antenna designs can be implemented. In a smart textile system, an unobtrusive integration of the different components is essential. However, this objective is not straightforward. In the active antenna’s fabrication process, the RF circuitry is directly integrated onto the flexible antenna. This offers increased performance by eliminating lossy wearable RF connections between the antenna and the active circuit, and it enables full-wave/circuit co-design, e.g. by matching the antenna impedance directly to the active circuit’s optimal input impedance [1]. Moreover, this approach improves robustness by reducing potential weak links between the antenna interconnects and the active circuitry, in the meanwhile making the complete wearable system more compact by eliminating the need for separate antennas and circuits. Copper-on-polyimide films offer an ideal solution for the RF circuit integrated in an active wearable antenna, allowing an accurate fabrication of the flexible RF interconnections. However, when laminated onto a textile substrate, the flexibility is greatly reduced, and the textile substrate introduces dielectric losses. Therefore, we propose a technique involving the laser cutting of the textile substrate around the RF circuitry, effectively removing the substrate up to very close distances to the conductive structures. The effects of the reduced substrate on the performance of the RF interconnections in the feed circuit and the coupling of the feed lines to the radiating element will be modeled by means of full 3D simulations and simplified planar 3D simulations. The full 3D simulations explicitly model the cut substrate, whereas the planar 3D simulations model the original, uncut substrate with an adjusted dielectric constant to allow for a faster design. These simulation appraoches will be validated by means of measurements on a manufactured prototype.".
- aggregation authorList BK88075.
- aggregation isDescribedBy 4217585.
- aggregation similarTo LU-4217585.