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- Anodic_bonding abstract "Anodic bonding is a process to seal glass to either silicon or metal; it is commonly used to seal glass to thin pieces of silicon in electronics and microfluidics. In the electronics industry, the term "wafer" is often used to describe thin pieces of glass or silicon.wafer bonding procedure without any intermediate layer. This bonding technique, also known as field assisted bonding or electrostatic sealing, is mostly used for connecting silicon/glass and metal/glass through electric fields. The requirements for anodic bonding are clean and even wafer surfaces and atomic contact between the bonding substrates through a sufficiently powerful electrostatic field. Also necessary is the use of borosilicate glass containing a high concentration of alkali ions. The coefficient of thermal expansion (CTE) of the processed glass needs to be similar to those of the bonding partner.Anodic bonding can be applied with glass wafers at temperatures of 250 to 400 °C or with sputtered glass at 400 °C. Structured borosilicate glass layers my also be deposited by plasma-assisted e-beam evaporation.This procedure is mostly used for hermetic encapsulation of micro-mechanical silicon elements. The glass substrate encapsulation protects from environmental influences, e.g. humidity or contamination. Further, other materials are used for anodic bonding with silicon, i.e. low-temperature cofired ceramics (LTCC).".
- Anodic_bonding wikiPageID "31321967".
- Anodic_bonding wikiPageRevisionID "603953402".
- Anodic_bonding hasPhotoCollection Anodic_bonding.
- Anodic_bonding subject Category:Chemical_bonding.
- Anodic_bonding subject Category:Electronics_manufacturing.
- Anodic_bonding subject Category:Packaging_(microfabrication).
- Anodic_bonding subject Category:Semiconductor_technology.
- Anodic_bonding subject Category:Wafer_bonding.
- Anodic_bonding comment "Anodic bonding is a process to seal glass to either silicon or metal; it is commonly used to seal glass to thin pieces of silicon in electronics and microfluidics. In the electronics industry, the term "wafer" is often used to describe thin pieces of glass or silicon.wafer bonding procedure without any intermediate layer. This bonding technique, also known as field assisted bonding or electrostatic sealing, is mostly used for connecting silicon/glass and metal/glass through electric fields.".
- Anodic_bonding label "Anodic bonding".
- Anodic_bonding label "Anodisches Bonden".
- Anodic_bonding sameAs Anodisches_Bonden.
- Anodic_bonding sameAs m.0gk_q0x.
- Anodic_bonding sameAs Q567503.
- Anodic_bonding sameAs Q567503.
- Anodic_bonding wasDerivedFrom Anodic_bonding?oldid=603953402.
- Anodic_bonding isPrimaryTopicOf Anodic_bonding.