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- Bumpless_Build-up_Layer abstract "Bumpless Build-up Layer or BBUL is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires. It has build-up layers, because is grown or built up around the silicon die. The usual way is to manufacture them separately and bond them together.It was presented in October 2001. It should have been a key component in the 8 GHz and 15 GHz processors that should have been in the market by 2005 and 2007 respectively. Also 20 GHz should have been possible before the year 2010.[citation needed] The BBUL is not needed yet because there is no longer the clock-frequency competition.".
- Bumpless_Build-up_Layer wikiPageExternalLink article3950.html.
- Bumpless_Build-up_Layer wikiPageExternalLink 20011008tech_bkgrd.htm.
- Bumpless_Build-up_Layer wikiPageExternalLink asme_bbul.pdf.
- Bumpless_Build-up_Layer wikiPageID "2360617".
- Bumpless_Build-up_Layer wikiPageRevisionID "601686737".
- Bumpless_Build-up_Layer hasPhotoCollection Bumpless_Build-up_Layer.
- Bumpless_Build-up_Layer subject Category:Intel_microprocessors.
- Bumpless_Build-up_Layer type Artifact100021939.
- Bumpless_Build-up_Layer type Chip103020034.
- Bumpless_Build-up_Layer type Conductor103088707.
- Bumpless_Build-up_Layer type Device103183080.
- Bumpless_Build-up_Layer type Instrumentality103575240.
- Bumpless_Build-up_Layer type IntelMicroprocessors.
- Bumpless_Build-up_Layer type Microprocessor103760310.
- Bumpless_Build-up_Layer type Object100002684.
- Bumpless_Build-up_Layer type PhysicalEntity100001930.
- Bumpless_Build-up_Layer type SemiconductorDevice104171831.
- Bumpless_Build-up_Layer type Whole100003553.
- Bumpless_Build-up_Layer comment "Bumpless Build-up Layer or BBUL is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires. It has build-up layers, because is grown or built up around the silicon die. The usual way is to manufacture them separately and bond them together.It was presented in October 2001.".
- Bumpless_Build-up_Layer label "Bumpless Build-up Layer".
- Bumpless_Build-up_Layer sameAs m.076fk7.
- Bumpless_Build-up_Layer sameAs Q4997348.
- Bumpless_Build-up_Layer sameAs Q4997348.
- Bumpless_Build-up_Layer sameAs Bumpless_Build-up_Layer.
- Bumpless_Build-up_Layer wasDerivedFrom Bumpless_Build-up_Layer?oldid=601686737.
- Bumpless_Build-up_Layer isPrimaryTopicOf Bumpless_Build-up_Layer.