Matches in DBpedia 2014 for { <http://dbpedia.org/resource/Contact_pad> ?p ?o. }
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- Contact_pad abstract "Contact pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include soldering, wirebonding, Flip chip mounting, or probe needles.".
- Contact_pad thumbnail Wirebond-ballbond.jpg?width=300.
- Contact_pad wikiPageID "27714583".
- Contact_pad wikiPageRevisionID "554701287".
- Contact_pad hasPhotoCollection Contact_pad.
- Contact_pad subject Category:Electronic_engineering.
- Contact_pad comment "Contact pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include soldering, wirebonding, Flip chip mounting, or probe needles.".
- Contact_pad label "Contact pad".
- Contact_pad sameAs m.0c3zlpp.
- Contact_pad sameAs Q5164840.
- Contact_pad sameAs Q5164840.
- Contact_pad wasDerivedFrom Contact_pad?oldid=554701287.
- Contact_pad depiction Wirebond-ballbond.jpg.
- Contact_pad isPrimaryTopicOf Contact_pad.
