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- Deep_reactive-ion_etching abstract "Deep reactive-ion etching (DRIE) is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios . It was developed for microelectromechanical systems (MEMS), which require these features, but is also used to excavate trenches for high-density capacitors for DRAM and more recently for creating through silicon via's (TSV)'s in advanced 3D wafer level packaging technology .There are two main technologies for high-rate DRIE: cryogenic and Bosch, although the Bosch process is the only recognised production technique. Both Bosch and cryo processes can fabricate 90° (truly vertical) walls, but often the walls are slightly tapered, e.g. 88° or 92° ("retrograde").Another mechanism is sidewall passivation: SiOxFy functional groups (which originate from sulphur hexafluoride and oxygen etch gases) condense on the sidewalls, and protect them from lateral etching. As a combination of these processes deep vertical structures can be made.".
- Deep_reactive-ion_etching thumbnail Bosch_process_PILLAR.jpg?width=300.
- Deep_reactive-ion_etching wikiPageID "2445044".
- Deep_reactive-ion_etching wikiPageRevisionID "551881347".
- Deep_reactive-ion_etching hasPhotoCollection Deep_reactive-ion_etching.
- Deep_reactive-ion_etching subject Category:Etching_(microfabrication).
- Deep_reactive-ion_etching subject Category:Microtechnology.
- Deep_reactive-ion_etching subject Category:Semiconductor_device_fabrication.
- Deep_reactive-ion_etching comment "Deep reactive-ion etching (DRIE) is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios .".
- Deep_reactive-ion_etching label "Deep reactive-ion etching".
- Deep_reactive-ion_etching label "Gravure ionique réactive profonde".
- Deep_reactive-ion_etching label "Reaktives Ionentiefenätzen".
- Deep_reactive-ion_etching label "深堀りRIE".
- Deep_reactive-ion_etching sameAs Reaktives_Ionentiefenätzen.
- Deep_reactive-ion_etching sameAs Gravure_ionique_réactive_profonde.
- Deep_reactive-ion_etching sameAs 深堀りRIE.
- Deep_reactive-ion_etching sameAs m.07dk4j.
- Deep_reactive-ion_etching sameAs Q486936.
- Deep_reactive-ion_etching sameAs Q486936.
- Deep_reactive-ion_etching wasDerivedFrom Deep_reactive-ion_etching?oldid=551881347.
- Deep_reactive-ion_etching depiction Bosch_process_PILLAR.jpg.
- Deep_reactive-ion_etching isPrimaryTopicOf Deep_reactive-ion_etching.
