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- Die_shrink abstract "The term die shrink (sometimes optical shrink or process shrink) refers to a simple semiconductor scaling of semiconductor devices, mainly transistors. The act of shrinking a die is to create a somewhat identical circuitry using a more advanced fabrication process, usually involving an advance of lithographic node. This reduces overall costs of a chip company, as the absence of major architectural changes to the processor lowers research and development costs, while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.".
- Die_shrink wikiPageExternalLink RDA-SMIC-make-mixed-signal-IC.
- Die_shrink wikiPageExternalLink SiliconBlue-tips-FPGA-move-to-40-nm.
- Die_shrink wikiPageExternalLink Design-starts-triple-for-TSMC-at-28-nm.
- Die_shrink wikiPageExternalLink ON-Semi-offers-110-nm-ASIC-platform.
- Die_shrink wikiPageExternalLink 28nm.aspx.
- Die_shrink wikiPageExternalLink 40nm.aspx.
- Die_shrink wikiPageExternalLink content.do?id=16649.
- Die_shrink wikiPageExternalLink TSMC-Reiterates-28-nm-Readiness-by-Q4-2011.html.
- Die_shrink wikiPageExternalLink f.asp.
- Die_shrink wikiPageExternalLink 55nmprocess.html.
- Die_shrink wikiPageID "14001145".
- Die_shrink wikiPageRevisionID "597135988".
- Die_shrink hasPhotoCollection Die_shrink.
- Die_shrink subject Category:Integrated_circuits.
- Die_shrink subject Category:Semiconductors.
- Die_shrink type Artifact100021939.
- Die_shrink type Circuit103033362.
- Die_shrink type ComputerCircuit103084420.
- Die_shrink type Device103183080.
- Die_shrink type ElectricalDevice103269401.
- Die_shrink type Instrumentality103575240.
- Die_shrink type IntegratedCircuit103577090.
- Die_shrink type IntegratedCircuits.
- Die_shrink type Object100002684.
- Die_shrink type PhysicalEntity100001930.
- Die_shrink type Whole100003553.
- Die_shrink comment "The term die shrink (sometimes optical shrink or process shrink) refers to a simple semiconductor scaling of semiconductor devices, mainly transistors. The act of shrinking a die is to create a somewhat identical circuitry using a more advanced fabrication process, usually involving an advance of lithographic node.".
- Die_shrink label "Die shrink".
- Die_shrink label "Die shrink".
- Die_shrink label "Die shrink".
- Die_shrink label "Die shrink".
- Die_shrink label "Shrink".
- Die_shrink sameAs Shrink.
- Die_shrink sameAs Die_shrink.
- Die_shrink sameAs Die_shrink.
- Die_shrink sameAs 다이_시링크.
- Die_shrink sameAs Die_shrink.
- Die_shrink sameAs m.03cqn6d.
- Die_shrink sameAs Q764678.
- Die_shrink sameAs Q764678.
- Die_shrink sameAs Die_shrink.
- Die_shrink wasDerivedFrom Die_shrink?oldid=597135988.
- Die_shrink isPrimaryTopicOf Die_shrink.