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• Embedded_Wafer_Level_Ball_Grid_Array abstract "Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound.eWLB is a further development of the classical Wafer Level Ball Grid Array Technology (WLB or WLP: wafer level package). The main driving force behind the eWLB technology was to allow fanout and more space for interconnect routing.All process steps for the generation of the package are performed on the wafer. This allows, in comparison to classical packaging technologies (e. g. ball grid array), the generation of very small and flat packages with excellent electrical and thermal performance at lowest cost. It is common for all WLB technologies, which are built on a silicon wafer, that the interconnects (typically solder balls) fit on the chip (so called fan-in design). Therefore only chips with a restricted number of interconnects can be packaged.The eWLB technology allows the realization of chips with a high number of interconnects. The package is not realized on a silicon wafer as for classical Wafer Level Package, but on an artificial wafer. Therefore a front-end-processed wafer is diced and the singulated chips are placed on a carrier. The distance between the chips can be chosen freely, but it is typically larger than on the silicon wafer. The gaps and the edges around the chips are now filled with a casting compound to form a wafer. After curing an artificial wafer containing a mold frame around the dies for carrying additional interconnect elements is realized. After the built of the artificial wafer (the so-called Reconstitution) the electrical connections from the chip pads to the interconnects are realized in thin-film technology, like for any other classical Wafer Level Package.With this technology any number of additional interconnects can be realized on the package in an arbitrary distance (fan-out design). Therefore this Wafer Level Packaging Technology can also be used for space sensitive applications, where the chip area wouldn’t be sufficient to place the needed number of interconnects in a realizable distance. The eWLB Technology was developed by Infineon, STMicroelectronics and STATS ChipPAC Ltd. First components were brought into market mid of 2009 (mobile phone).".
• Embedded_Wafer_Level_Ball_Grid_Array thumbnail EWLB_Sketch_e.png?width=300.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink 6-Plieninger-ESTC_Keynote_20060907.pdf.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink template.asp?content=innovationen.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink 4.htm.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink login.jsp?url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel5%2F4147209%2F4141004%2F04147210.pdf%3Farnumber%3D4147210&authDecision=-203.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink cspnl.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink 0.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink INFCOM200711-013.html.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink 26088?snc=20641&snc=20641.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink STATSChipPAC_ECTC2010_s24p5.ashx.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink eWLB.ashx.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink 19576.html.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageExternalLink WFR14-1.pdf.
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageID "26699884".
• Embedded_Wafer_Level_Ball_Grid_Array wikiPageRevisionID "601360476".
• Embedded_Wafer_Level_Ball_Grid_Array hasPhotoCollection Embedded_Wafer_Level_Ball_Grid_Array.
• Embedded_Wafer_Level_Ball_Grid_Array subject Category:Chip_carriers.
• Embedded_Wafer_Level_Ball_Grid_Array type Carrier109897696.
• Embedded_Wafer_Level_Ball_Grid_Array type CausalAgent100007347.
• Embedded_Wafer_Level_Ball_Grid_Array type ChipCarriers.
• Embedded_Wafer_Level_Ball_Grid_Array type LivingThing100004258.
• Embedded_Wafer_Level_Ball_Grid_Array type Object100002684.
• Embedded_Wafer_Level_Ball_Grid_Array type Organism100004475.
• Embedded_Wafer_Level_Ball_Grid_Array type Person100007846.
• Embedded_Wafer_Level_Ball_Grid_Array type PhysicalEntity100001930.
• Embedded_Wafer_Level_Ball_Grid_Array type Traveler109629752.
• Embedded_Wafer_Level_Ball_Grid_Array type Whole100003553.
• Embedded_Wafer_Level_Ball_Grid_Array type YagoLegalActor.
• Embedded_Wafer_Level_Ball_Grid_Array type YagoLegalActorGeo.
• Embedded_Wafer_Level_Ball_Grid_Array comment "Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound.eWLB is a further development of the classical Wafer Level Ball Grid Array Technology (WLB or WLP: wafer level package).".
• Embedded_Wafer_Level_Ball_Grid_Array label "Embedded Wafer Level Ball Grid Array".
• Embedded_Wafer_Level_Ball_Grid_Array label "Embedded Wafer Level Ball Grid Array".
• Embedded_Wafer_Level_Ball_Grid_Array sameAs Embedded_Wafer_Level_Ball_Grid_Array.
• Embedded_Wafer_Level_Ball_Grid_Array sameAs m.0bmdl5s.
• Embedded_Wafer_Level_Ball_Grid_Array sameAs Q368513.
• Embedded_Wafer_Level_Ball_Grid_Array sameAs Q368513.
• Embedded_Wafer_Level_Ball_Grid_Array sameAs Embedded_Wafer_Level_Ball_Grid_Array.
• Embedded_Wafer_Level_Ball_Grid_Array wasDerivedFrom Embedded_Wafer_Level_Ball_Grid_Array?oldid=601360476.
• Embedded_Wafer_Level_Ball_Grid_Array depiction EWLB_Sketch_e.png.
• Embedded_Wafer_Level_Ball_Grid_Array isPrimaryTopicOf Embedded_Wafer_Level_Ball_Grid_Array.