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- Hybrid_Memory_Cube abstract "Hybrid Memory Cube (HMC) is a new type of computer RAM technology developed by Micron Technology. The Hybrid Memory Cube Consortium (HMCC) is backed by several major technology companies including Samsung, Micron Technology, ARM, HP, Microsoft, Altera, and Xilinx.The HMC uses 3D packaging of multiple memory dies, typically 4 or 8 memory dies per package, with using of through-silicon vias (TSV) and microbumps. It has more data banks than classic DRAM memory of the same size. The Memory controller is integrated into memory package as a separate logic die. The HMC uses standard DRAM cells, but its interface is incompatible with current DDRn (DDR2 or DDR3) implementations.HMC technology won the Best New Technology award from The Linley Group (publisher of Microprocessor Report magazine) in 2011.The First public specification, HMC 1.0, was published in April 2013. According to it, The HMC uses 16-lane or 8-lane (half size) full-duplex differential serial links, with each lane having 10, 12.5 or 15 Gbit/s SerDes. Each HMC package is named a cube, and they can be chained in a network of up to 8 cubes with cube-to-cube links and some cubes using their links as pass-thru links. Typical cube package with 4 links has 896 BGA pins and sized 31x31x3,8 millimeters.Typical raw bandwidth of single 16-lane link with 10 Gbit/s signalling is 40 GB/s (20 GB/s transmit and 20 GB/s receive); cubes with 4 and 8 links are planned. Effective memory bandwidth utilization varies in 50%-33% for smallest packets of 32 bytes; and in 85%-45% for 128 byte packets.As reported at the HotChips 23 conference in 2011, the first generation of HMC demonstration cubes with four 50 nm DRAM memory dies and one 90 nm logic die with total capacity of 512 MB and size 27x27 mm had power consumption of 11 W and was powered with 1.2 V.Engineering samples of 2nd Generation HMC memory chips were announced in September 2013 by Micron and mass production of HMC may start in 2014. Samples of 2GB HMC (stack of 4 memory dies, each of 4 Gbit) are packed in 31×31 mm package and has 4 HMC links. Other samples from 2013 has only two HMC links and a smaller package: 16×19.5 mmVolume production of 2 and 4 GB devices are planned for 2014.".
- Hybrid_Memory_Cube wikiPageExternalLink 20130402_HPCwire_%20Stacking%20Stairs%20Against%20the%20Memory%20Wall.pdf.
- Hybrid_Memory_Cube wikiPageExternalLink HMC_Specification%201_0.pdf.
- Hybrid_Memory_Cube wikiPageExternalLink HC23.18.320-HybridCube-Pawlowski-Micron.pdf.
- Hybrid_Memory_Cube wikiPageID "38898926".
- Hybrid_Memory_Cube wikiPageRevisionID "603557432".
- Hybrid_Memory_Cube hasPhotoCollection Hybrid_Memory_Cube.
- Hybrid_Memory_Cube subject Category:Computer_memory.
- Hybrid_Memory_Cube subject Category:Types_of_RAM.
- Hybrid_Memory_Cube comment "Hybrid Memory Cube (HMC) is a new type of computer RAM technology developed by Micron Technology. The Hybrid Memory Cube Consortium (HMCC) is backed by several major technology companies including Samsung, Micron Technology, ARM, HP, Microsoft, Altera, and Xilinx.The HMC uses 3D packaging of multiple memory dies, typically 4 or 8 memory dies per package, with using of through-silicon vias (TSV) and microbumps. It has more data banks than classic DRAM memory of the same size.".
- Hybrid_Memory_Cube label "Hybrid Memory Cube".
- Hybrid_Memory_Cube label "Hybrid Memory Cube".
- Hybrid_Memory_Cube label "Hybrid Memory Cube".
- Hybrid_Memory_Cube label "Hybrid Memory Cube".
- Hybrid_Memory_Cube sameAs Hybrid_Memory_Cube.
- Hybrid_Memory_Cube sameAs Hybrid_Memory_Cube.
- Hybrid_Memory_Cube sameAs m.0ryttrr.
- Hybrid_Memory_Cube sameAs Q3143645.
- Hybrid_Memory_Cube sameAs Q3143645.
- Hybrid_Memory_Cube wasDerivedFrom Hybrid_Memory_Cube?oldid=603557432.
- Hybrid_Memory_Cube homepage www.hybridmemorycube.org.
- Hybrid_Memory_Cube isPrimaryTopicOf Hybrid_Memory_Cube.