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- Integrated_circuit_packaging abstract "In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly. Sometimes it is called encapsulation or seal. The packaging stage is followed by testing of the integrated circuit.The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards.".
- Integrated_circuit_packaging thumbnail RUS-IC.JPG?width=300.
- Integrated_circuit_packaging wikiPageExternalLink ngl.
- Integrated_circuit_packaging wikiPageID "513418".
- Integrated_circuit_packaging wikiPageRevisionID "586701721".
- Integrated_circuit_packaging hasPhotoCollection Integrated_circuit_packaging.
- Integrated_circuit_packaging subject Category:Chip_carriers.
- Integrated_circuit_packaging subject Category:Packaging_(microfabrication).
- Integrated_circuit_packaging subject Category:Semiconductor_device_fabrication.
- Integrated_circuit_packaging type Carrier109897696.
- Integrated_circuit_packaging type CausalAgent100007347.
- Integrated_circuit_packaging type ChipCarriers.
- Integrated_circuit_packaging type LivingThing100004258.
- Integrated_circuit_packaging type Object100002684.
- Integrated_circuit_packaging type Organism100004475.
- Integrated_circuit_packaging type Person100007846.
- Integrated_circuit_packaging type PhysicalEntity100001930.
- Integrated_circuit_packaging type Traveler109629752.
- Integrated_circuit_packaging type Whole100003553.
- Integrated_circuit_packaging type YagoLegalActor.
- Integrated_circuit_packaging type YagoLegalActorGeo.
- Integrated_circuit_packaging comment "In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly.".
- Integrated_circuit_packaging label "Aufbau- und Verbindungstechnik".
- Integrated_circuit_packaging label "Encapsulation (électronique)".
- Integrated_circuit_packaging label "Integrated circuit packaging".
- Integrated_circuit_packaging label "Корпусирование ИС".
- Integrated_circuit_packaging label "パッケージ (電子部品)".
- Integrated_circuit_packaging label "集成电路封装".
- Integrated_circuit_packaging sameAs Aufbau-_und_Verbindungstechnik.
- Integrated_circuit_packaging sameAs Encapsulation_(électronique).
- Integrated_circuit_packaging sameAs パッケージ_(電子部品).
- Integrated_circuit_packaging sameAs m.02k8vp.
- Integrated_circuit_packaging sameAs Q759494.
- Integrated_circuit_packaging sameAs Q759494.
- Integrated_circuit_packaging sameAs Integrated_circuit_packaging.
- Integrated_circuit_packaging wasDerivedFrom Integrated_circuit_packaging?oldid=586701721.
- Integrated_circuit_packaging depiction RUS-IC.JPG.
- Integrated_circuit_packaging isPrimaryTopicOf Integrated_circuit_packaging.
