Matches in DBpedia 2014 for { <http://dbpedia.org/resource/Package_on_package> ?p ?o. }
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- Package_on_package abstract "Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras.".
- Package_on_package thumbnail ASIC_+_Memory_PoP_Schematic.JPG?width=300.
- Package_on_package wikiPageExternalLink beagleboard.org.
- Package_on_package wikiPageExternalLink 10161-defects-database.
- Package_on_package wikiPageExternalLink 10284-defectsdatabase.
- Package_on_package wikiPageExternalLink 10618-defects-database.
- Package_on_package wikiPageExternalLink proceedings_abstract.cfm?PROC_ID=2649.
- Package_on_package wikiPageExternalLink BNP_GUID_9-5-2006_A_10000000000000433369.
- Package_on_package wikiPageExternalLink showArticle.jhtml?articleID=211201709.
- Package_on_package wikiPageExternalLink showArticle.jhtml?articleID=209900383&cid=RSSfeed_eetimes_semiRSS.
- Package_on_package wikiPageExternalLink www.packageonpackagebook.com.
- Package_on_package wikiPageExternalLink amkor-pop.htm.
- Package_on_package wikiPageExternalLink CA6445430.html.
- Package_on_package wikiPageExternalLink CA6611115.html?desc=topstory.
- Package_on_package wikiPageExternalLink Semiconductor_Intl_PoP_April_2010.ashx''Innovations.
- Package_on_package wikiPageExternalLink STATSChipPAC_ECTC2010_s40p01.ashx.
- Package_on_package wikiPageExternalLink POP.ashx.
- Package_on_package wikiPageID "12792117".
- Package_on_package wikiPageRevisionID "587927598".
- Package_on_package hasPhotoCollection Package_on_package.
- Package_on_package subject Category:Chip_carriers.
- Package_on_package subject Category:Packaging_(microfabrication).
- Package_on_package subject Category:Semiconductor_device_fabrication.
- Package_on_package type Carrier109897696.
- Package_on_package type CausalAgent100007347.
- Package_on_package type ChipCarriers.
- Package_on_package type LivingThing100004258.
- Package_on_package type Object100002684.
- Package_on_package type Organism100004475.
- Package_on_package type Person100007846.
- Package_on_package type PhysicalEntity100001930.
- Package_on_package type Traveler109629752.
- Package_on_package type Whole100003553.
- Package_on_package type YagoLegalActor.
- Package_on_package type YagoLegalActorGeo.
- Package_on_package comment "Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras.".
- Package_on_package label "Package on Package".
- Package_on_package label "Package on package".
- Package_on_package label "Package-on-Package".
- Package_on_package sameAs Package-on-Package.
- Package_on_package sameAs Package_on_Package.
- Package_on_package sameAs m.02x53fv.
- Package_on_package sameAs Q130652.
- Package_on_package sameAs Q130652.
- Package_on_package sameAs Package_on_package.
- Package_on_package wasDerivedFrom Package_on_package?oldid=587927598.
- Package_on_package depiction ASIC_+_Memory_PoP_Schematic.JPG.
- Package_on_package isPrimaryTopicOf Package_on_package.
