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- Process_corners abstract "In semiconductor manufacturing, a process corner is an example of a design-of-experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners represent the extremes of these parameter variations within which a circuit that has been etched onto the wafer must function correctly. A circuit running on devices fabricated at these process corners may run slower or faster than specified and at lower or higher temperatures and voltages, but if the circuit does not function at all at any of these process extremes the design is considered to have inadequate design margin.In order to verify the robustness of an integrated circuit design, semiconductor manufacturers will fabricate corner lots, which are groups of wafers that have had process parameters adjusted according to these extremes, and will then test the devices made from these special wafers at varying increments of environmental conditions, such as voltage, clock frequency, and temperature, applied in combination (two or sometimes all three together) in a process called characterization. The results of these tests are plotted using a graphing technique known as a shmoo plot that indicates clearly the boundary limit beyond which a device begins to fail for a given combination of these environmental conditions. Corner-lot analysis is most effective in digital electronics because of the direct effect of process variations on the speed of transistor switching during transitions from one logic state to another, which is not relevant for analog circuits, such as amplifiers.".
- Process_corners wikiPageExternalLink why-three-sigma.
- Process_corners wikiPageExternalLink patents?id=EKwOAAAAEBAJ.
- Process_corners wikiPageID "18648165".
- Process_corners wikiPageRevisionID "602751696".
- Process_corners hasPhotoCollection Process_corners.
- Process_corners subject Category:Integrated_circuits.
- Process_corners type Artifact100021939.
- Process_corners type Circuit103033362.
- Process_corners type ComputerCircuit103084420.
- Process_corners type Device103183080.
- Process_corners type ElectricalDevice103269401.
- Process_corners type Instrumentality103575240.
- Process_corners type IntegratedCircuit103577090.
- Process_corners type IntegratedCircuits.
- Process_corners type Object100002684.
- Process_corners type PhysicalEntity100001930.
- Process_corners type Whole100003553.
- Process_corners comment "In semiconductor manufacturing, a process corner is an example of a design-of-experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners represent the extremes of these parameter variations within which a circuit that has been etched onto the wafer must function correctly.".
- Process_corners label "Process corners".
- Process_corners sameAs m.04gqn03.
- Process_corners sameAs Q7247268.
- Process_corners sameAs Q7247268.
- Process_corners sameAs Process_corners.
- Process_corners wasDerivedFrom Process_corners?oldid=602751696.
- Process_corners isPrimaryTopicOf Process_corners.