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- Reactive_bonding abstract "Reactive bonding describes a wafer bonding procedure using highly reactive nanoscale multilayer systems as an intermediate layer between the bonding substrates. The multilayer system consists of two alternating different thin metallic films. The self-propagating exothermic reaction within the multilayer system contributes the local heat to bond the solder films. Based on the limited temperature the substrate material is exposed, temperature-sensitive components and materials with different CTEs, i.e. metals, polymers and ceramics, can be used without thermal damage.".
- Reactive_bonding thumbnail B-r-multilayersystem.png?width=300.
- Reactive_bonding wikiPageExternalLink www.enas.fraunhofer.de.
- Reactive_bonding wikiPageID "31336137".
- Reactive_bonding wikiPageRevisionID "598870034".
- Reactive_bonding hasPhotoCollection Reactive_bonding.
- Reactive_bonding subject Category:Brazing_and_soldering.
- Reactive_bonding subject Category:Electronics_manufacturing.
- Reactive_bonding subject Category:Packaging_(microfabrication).
- Reactive_bonding subject Category:Semiconductor_technology.
- Reactive_bonding subject Category:Wafer_bonding.
- Reactive_bonding comment "Reactive bonding describes a wafer bonding procedure using highly reactive nanoscale multilayer systems as an intermediate layer between the bonding substrates. The multilayer system consists of two alternating different thin metallic films. The self-propagating exothermic reaction within the multilayer system contributes the local heat to bond the solder films.".
- Reactive_bonding label "Reactive bonding".
- Reactive_bonding sameAs m.0gk_46f.
- Reactive_bonding sameAs Q7300303.
- Reactive_bonding sameAs Q7300303.
- Reactive_bonding wasDerivedFrom Reactive_bonding?oldid=598870034.
- Reactive_bonding depiction B-r-multilayersystem.png.
- Reactive_bonding isPrimaryTopicOf Reactive_bonding.
