Matches in DBpedia 2014 for { <http://dbpedia.org/resource/Redistribution_layer> ?p ?o. }
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- Redistribution_layer abstract "A Redistribution Layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations.".
- Redistribution_layer wikiPageExternalLink redistribution-layers.
- Redistribution_layer wikiPageID "32008772".
- Redistribution_layer wikiPageRevisionID "560235892".
- Redistribution_layer hasPhotoCollection Redistribution_layer.
- Redistribution_layer subject Category:Packaging_(microfabrication).
- Redistribution_layer subject Category:Semiconductor_device_fabrication.
- Redistribution_layer comment "A Redistribution Layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations.".
- Redistribution_layer label "Redistribution layer".
- Redistribution_layer sameAs m.0gx10xm.
- Redistribution_layer sameAs Q7305977.
- Redistribution_layer sameAs Q7305977.
- Redistribution_layer wasDerivedFrom Redistribution_layer?oldid=560235892.
- Redistribution_layer isPrimaryTopicOf Redistribution_layer.