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- System_in_package abstract "A system in package (SiP) or system-in-a-package, also known as a Chip Stack MCM. A SiP is a number of integrated circuits enclosed in a single module (package). The SiP performs all or most of the functions of an electronic system, and are typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits, may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together.SiP dies can be stacked vertically or tiled horizontally, unlike slightly less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die.Many different 3-D packaging techniques have been developed for stacking many more-or-less standard chip dies into a compact area.An example SiP can contain several chips—such as a specialized processor, DRAM, flash memory—combined with passive components—resistors and capacitors—all mounted on the same substrate. This means that a complete functional unit can be built in a multi-chip package, so that few external components need to be added to make it work. This is particularly valuable in space constrained environments like MP3 players and mobile phones as it reduces the complexity of the printed circuit board and overall design. Despite its benefits, this technique decreases the yield of fabrication since any defective chip in the package will result in a non-functional packaged integrated circuit, even if all other modules in that same package are functional.".
- System_in_package wikiPageID "4093822".
- System_in_package wikiPageRevisionID "602105430".
- System_in_package hasPhotoCollection System_in_package.
- System_in_package type Artifact100021939.
- System_in_package type Circuit103033362.
- System_in_package type ComputerCircuit103084420.
- System_in_package type ComputerSystem103085915.
- System_in_package type ComputerSystems.
- System_in_package type Device103183080.
- System_in_package type ElectricalDevice103269401.
- System_in_package type Instrumentality103575240.
- System_in_package type IntegratedCircuit103577090.
- System_in_package type IntegratedCircuits.
- System_in_package type Object100002684.
- System_in_package type PhysicalEntity100001930.
- System_in_package type System104377057.
- System_in_package type Whole100003553.
- System_in_package comment "A system in package (SiP) or system-in-a-package, also known as a Chip Stack MCM. A SiP is a number of integrated circuits enclosed in a single module (package). The SiP performs all or most of the functions of an electronic system, and are typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits, may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package.".
- System_in_package label "SiP".
- System_in_package label "SiP".
- System_in_package label "System in package".
- System_in_package label "System in package".
- System_in_package label "System-in-Package".
- System_in_package sameAs System-in-Package.
- System_in_package sameAs System_in_package.
- System_in_package sameAs SiP.
- System_in_package sameAs m.0bhnjw.
- System_in_package sameAs Q1457198.
- System_in_package sameAs Q1457198.
- System_in_package sameAs System_in_package.
- System_in_package wasDerivedFrom System_in_package?oldid=602105430.
- System_in_package isPrimaryTopicOf System_in_package.