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- Thermal_design_power abstract "The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of heat generated by the CPU, which the cooling system in a computer is required to dissipate in typical operation.The TDP is typically not the largest amount of heat the CPU could ever generate (peak power), such as by running a power virus, but rather the maximum amount of heat that it would generate when running "real applications." This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).Some sources state that the peak power for a microprocessor is usually 1.5 times the TDP rating. However, the TDP is a conventional figure while its measurement methodology has been the subject of controversy. In particular, until around 2006 AMD used to report the maximum power draw of its processors as TDP, but Intel changed this practice with the introduction of its Conroe family of processors. A similar but more recent controversy has involved the power TDP measurements of some Ivy Bridge Y-series processors, with which Intel has introduced a new metric they call scenario design power (SDP).".
- Thermal_design_power wikiPageID "1012800".
- Thermal_design_power wikiPageRevisionID "595478969".
- Thermal_design_power hasPhotoCollection Thermal_design_power.
- Thermal_design_power subject Category:Computer_engineering.
- Thermal_design_power comment "The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of heat generated by the CPU, which the cooling system in a computer is required to dissipate in typical operation.The TDP is typically not the largest amount of heat the CPU could ever generate (peak power), such as by running a power virus, but rather the maximum amount of heat that it would generate when running "real applications." This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).Some sources state that the peak power for a microprocessor is usually 1.5 times the TDP rating. ".
- Thermal_design_power label "Enveloppe thermique".
- Thermal_design_power label "Potencia de diseño térmico".
- Thermal_design_power label "Projeto de Força Térmica".
- Thermal_design_power label "Thermal Design Power".
- Thermal_design_power label "Thermal Design Power".
- Thermal_design_power label "Thermal Design Power".
- Thermal_design_power label "Thermal design power".
- Thermal_design_power label "Thermal design power".
- Thermal_design_power label "热设计功耗".
- Thermal_design_power label "熱設計電力".
- Thermal_design_power sameAs Thermal_Design_Power.
- Thermal_design_power sameAs Thermal_Design_Power.
- Thermal_design_power sameAs Potencia_de_diseño_térmico.
- Thermal_design_power sameAs Enveloppe_thermique.
- Thermal_design_power sameAs Thermal_Design_Power.
- Thermal_design_power sameAs 熱設計電力.
- Thermal_design_power sameAs 열_설계_전력.
- Thermal_design_power sameAs Thermal_design_power.
- Thermal_design_power sameAs Thermal_Design_Power.
- Thermal_design_power sameAs Projeto_de_Força_Térmica.
- Thermal_design_power sameAs m.03z4t9.
- Thermal_design_power sameAs Q1053879.
- Thermal_design_power sameAs Q1053879.
- Thermal_design_power wasDerivedFrom Thermal_design_power?oldid=595478969.
- Thermal_design_power isPrimaryTopicOf Thermal_design_power.