Matches in DBpedia 2014 for { <http://dbpedia.org/resource/Wafer-level_packaging> ?p ?o. }
Showing items 1 to 33 of
33
with 100 items per page.
- Wafer-level_packaging abstract "Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.There is no single industry-standard method of wafer-level packaging at present.".
- Wafer-level_packaging wikiPageExternalLink document.asp?doc_id=1254001.
- Wafer-level_packaging wikiPageExternalLink wl_package.htm.
- Wafer-level_packaging wikiPageID "23630276".
- Wafer-level_packaging wikiPageRevisionID "589748622".
- Wafer-level_packaging hasPhotoCollection Wafer-level_packaging.
- Wafer-level_packaging subject Category:Chip_carriers.
- Wafer-level_packaging subject Category:Electronics_manufacturing.
- Wafer-level_packaging subject Category:Semiconductor_technology.
- Wafer-level_packaging type Carrier109897696.
- Wafer-level_packaging type CausalAgent100007347.
- Wafer-level_packaging type ChipCarriers.
- Wafer-level_packaging type LivingThing100004258.
- Wafer-level_packaging type Object100002684.
- Wafer-level_packaging type Organism100004475.
- Wafer-level_packaging type Person100007846.
- Wafer-level_packaging type PhysicalEntity100001930.
- Wafer-level_packaging type Traveler109629752.
- Wafer-level_packaging type Whole100003553.
- Wafer-level_packaging type YagoLegalActor.
- Wafer-level_packaging type YagoLegalActorGeo.
- Wafer-level_packaging comment "Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.".
- Wafer-level_packaging label "Wafer-level packaging".
- Wafer-level_packaging label "Wafer-level packaging".
- Wafer-level_packaging label "ウエハーレベルCSP".
- Wafer-level_packaging sameAs Wafer-level_packaging.
- Wafer-level_packaging sameAs ウエハーレベルCSP.
- Wafer-level_packaging sameAs m.06zs2f3.
- Wafer-level_packaging sameAs Q4017648.
- Wafer-level_packaging sameAs Q4017648.
- Wafer-level_packaging sameAs Wafer-level_packaging.
- Wafer-level_packaging wasDerivedFrom Wafer-level_packaging?oldid=589748622.
- Wafer-level_packaging isPrimaryTopicOf Wafer-level_packaging.