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• catalog abstract "Like its celebrated predecessor, this Second Edition of VLSI Fabrication Principles adheres to the basic philosophy that there is a common core to the behavior and process technology of all semiconductor materials, and that looking at this subject from a unified point of view is the best way to stay up-to-date over the long term. By presenting a unified treatment of both elemental and compound semiconductor technologies, and by emphasizing the underlying principles that govern their behavior, this book gives students and practicing professionals the tools with which to stay up-to-date with the rapid changes in VLSI fabrication technology. All chapters have been modified and expanded to reflect a growing understanding of VLSI fabrication processes and shifts in the direction of process technology. The chapter on Epitaxy, for instance, has been greatly expanded and a new section added on molecular beam epitaxy, while the section on liquid phase epitaxy has been shortened because of its diminished role in process technology. New material on dry etching techniques has been incorporated in the chapter on Etching and Cleaning. In some places, the order of presentation has been changed to fine-tune the book's effectiveness as a senior and graduate-level teaching text. Fabrication principles covered include those for such circuits as CMOS, BIPOLAR, BICMOS, FET, and more. . VLSI Fabrication Principles will equip students to cope, not only with state-of-the-art techniques, but with future developments as well. It will continue to be a valuable asset long after course work is done. For electrical engineers, physicists, and materials scientists, it will aid in understanding the limitations of fabrication processes used to make modern, solid-state and optoelectronic devices and circuits.".
• catalog alternative "Very large scale integration fabrication principles.".
• catalog contributor b6637720.
• catalog created "c1994.".
• catalog date "1994".
• catalog date "c1994.".
• catalog dateCopyrighted "c1994.".
• catalog description ". VLSI Fabrication Principles will equip students to cope, not only with state-of-the-art techniques, but with future developments as well. It will continue to be a valuable asset long after course work is done. For electrical engineers, physicists, and materials scientists, it will aid in understanding the limitations of fabrication processes used to make modern, solid-state and optoelectronic devices and circuits.".
• catalog description "4.10. Evaluation Techniques for Diffused Layers -- 5. Epitaxy. 5.1. General Considerations. 5.2. Molecular Beam Epitaxy. 5.3. Vapor-Phase Epitaxy. 5.4. VPE Processes for Silicon. 5.5. VPE Processes for Gallium Arsenide. 5.6. Liquid-Phase Epitaxy. 5.7. LPE Systems. 5.8. Heteroepitaxy. 5.9. Evaluation of Epitaxial Layers -- 6. Ion Implantation. 6.1. Penetration Range. 6.2. Implantation Damage. 6.3. Annealing. 6.4. Ion Implantation Systems. 6.5. Process Considerations. 6.6. High-Energy Implants. 6.7. High-Current Implants. 6.8. Application to Silicon. 6.9. Application to Gallium Arsenide -- 7. Native Films. 7.1. Thermal Oxidation of Silicon. 7.2. Thermal Nitridation of Silicon. 7.3. Thermal Oxidation of Gallium Arsenide. 7.4. Anodic Oxidation. 7.5. Plasma Processes. 7.6. Evaluation of Native Films -- 8. Deposited Films. 8.1. Film Deposition Methods. 8.2. Film Characteristics. 8.3. Films for Protection and Masking. 8.4. Films for Doping. 8.5. Films for Interconnections. 8.6. Films for Ohmic Contacts.".
• catalog description "8.7. Films for Schottky Diodes -- 9. Etching and Cleaning. 9.1. Wet Chemical Etching. 9.2. Dry Physical Etching. 9.3. Dry Chemical Etching. 9.4. Reactive Ion Etching. 9.5. Chemically Assisted Ion Beam Techniques. 9.6. Etching-Induced Damage. 9.7. Cleaning -- 10. Lithographic Processes. 10.1. Photoreactive Materials. 10.2. Pattern Generation and Mask-Making. 10.3. Pattern Transfer. 10.4. Advanced Techniques. 10.5. Problem Areas -- 11. Device and Circuit Fabrication. 11.1. Isolation. 11.2. Self-Alignment. 11.3. Local Oxidation. 11.4. Planarization. 11.5. Metallization. 11.6. Gettering. 11.7. MOS-Based Silicon Microcircuits. 11.8. BJT-Based Silicon Microcircuits. 11.9. Gallium Arsenide Microcircuits -- Appendix: The Mathematics of Diffusion. A.1. Solutions for a Constant Diffusion Coefficient. A.2. Solution for a Time-Dependent Diffusion Coefficient. A.3. Solution for Concentration-Dependent Diffusion Coefficients. A.4. Determination of the Diffusion Constant.".
• catalog description "All chapters have been modified and expanded to reflect a growing understanding of VLSI fabrication processes and shifts in the direction of process technology. The chapter on Epitaxy, for instance, has been greatly expanded and a new section added on molecular beam epitaxy, while the section on liquid phase epitaxy has been shortened because of its diminished role in process technology. New material on dry etching techniques has been incorporated in the chapter on Etching and Cleaning.".
• catalog description "By presenting a unified treatment of both elemental and compound semiconductor technologies, and by emphasizing the underlying principles that govern their behavior, this book gives students and practicing professionals the tools with which to stay up-to-date with the rapid changes in VLSI fabrication technology.".
• catalog description "In some places, the order of presentation has been changed to fine-tune the book's effectiveness as a senior and graduate-level teaching text. Fabrication principles covered include those for such circuits as CMOS, BIPOLAR, BICMOS, FET, and more.".
• catalog description "Includes bibliographical references and index.".
• catalog description "Like its celebrated predecessor, this Second Edition of VLSI Fabrication Principles adheres to the basic philosophy that there is a common core to the behavior and process technology of all semiconductor materials, and that looking at this subject from a unified point of view is the best way to stay up-to-date over the long term.".
• catalog extent "xxiv, 834 p. :".
• catalog hasFormat "VLSI fabrication principles.".
• catalog identifier "0471580058 (alk. paper)".
• catalog isFormatOf "VLSI fabrication principles.".
• catalog issued "1994".
• catalog issued "c1994.".
• catalog language "eng".
• catalog publisher "New York : J. Wiley,".
• catalog relation "VLSI fabrication principles.".
• catalog subject "621.3815/2 20".
• catalog subject "Gallium arsenide.".
• catalog subject "Integrated circuits Very large scale integration.".
• catalog subject "Silicon.".
• catalog subject "TK7874 .G473 1994".
• catalog tableOfContents "4.10. Evaluation Techniques for Diffused Layers -- 5. Epitaxy. 5.1. General Considerations. 5.2. Molecular Beam Epitaxy. 5.3. Vapor-Phase Epitaxy. 5.4. VPE Processes for Silicon. 5.5. VPE Processes for Gallium Arsenide. 5.6. Liquid-Phase Epitaxy. 5.7. LPE Systems. 5.8. Heteroepitaxy. 5.9. Evaluation of Epitaxial Layers -- 6. Ion Implantation. 6.1. Penetration Range. 6.2. Implantation Damage. 6.3. Annealing. 6.4. Ion Implantation Systems. 6.5. Process Considerations. 6.6. High-Energy Implants. 6.7. High-Current Implants. 6.8. Application to Silicon. 6.9. Application to Gallium Arsenide -- 7. Native Films. 7.1. Thermal Oxidation of Silicon. 7.2. Thermal Nitridation of Silicon. 7.3. Thermal Oxidation of Gallium Arsenide. 7.4. Anodic Oxidation. 7.5. Plasma Processes. 7.6. Evaluation of Native Films -- 8. Deposited Films. 8.1. Film Deposition Methods. 8.2. Film Characteristics. 8.3. Films for Protection and Masking. 8.4. Films for Doping. 8.5. Films for Interconnections. 8.6. Films for Ohmic Contacts.".
• catalog tableOfContents "8.7. Films for Schottky Diodes -- 9. Etching and Cleaning. 9.1. Wet Chemical Etching. 9.2. Dry Physical Etching. 9.3. Dry Chemical Etching. 9.4. Reactive Ion Etching. 9.5. Chemically Assisted Ion Beam Techniques. 9.6. Etching-Induced Damage. 9.7. Cleaning -- 10. Lithographic Processes. 10.1. Photoreactive Materials. 10.2. Pattern Generation and Mask-Making. 10.3. Pattern Transfer. 10.4. Advanced Techniques. 10.5. Problem Areas -- 11. Device and Circuit Fabrication. 11.1. Isolation. 11.2. Self-Alignment. 11.3. Local Oxidation. 11.4. Planarization. 11.5. Metallization. 11.6. Gettering. 11.7. MOS-Based Silicon Microcircuits. 11.8. BJT-Based Silicon Microcircuits. 11.9. Gallium Arsenide Microcircuits -- Appendix: The Mathematics of Diffusion. A.1. Solutions for a Constant Diffusion Coefficient. A.2. Solution for a Time-Dependent Diffusion Coefficient. A.3. Solution for Concentration-Dependent Diffusion Coefficients. A.4. Determination of the Diffusion Constant.".
• catalog title "VLSI fabrication principles : silicon and gallium arsenide / Sorab K. Ghandhi.".
• catalog title "Very large scale integration fabrication principles.".
• catalog type "text".