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- catalog contributor b8515237.
- catalog contributor b8515238.
- catalog created "c1995.".
- catalog date "1995".
- catalog date "c1995.".
- catalog dateCopyrighted "c1995.".
- catalog description "Includes bibliographical references and indexes.".
- catalog description "Materials Research Society Symposium Proceedings -- Material Science and the Electronic Packaging Roadmap / C.A. Steidel, R.C. Sundahl and N. Grayeli -- Electronic Packaging Education in U.S. / Rao R. Tummala -- Electronics Packaging Materials Research at NIST / Michael A. Schen, G.T. Davis, F.I. Mopsik, W.L. Wu, W.E. Wallace, J.R. Manning, C.A. Handwerker and D.T. Read -- Thin Film Integral Capacitor Fabricated on a Polymer Dielectric for High Density Interconnect (HDI) Applications / Kyung W. Paik and Toh-Ming Lu -- Stress Concentrations in Electronic Packaging / Ravi Mahajan, Erdogan Madenci, Levent Ileri and Mark Thurston -- Determination of the Adhesive Strength of Film-Substrate Interfaces Using the Constant Depth Scratch Test / I. Dutta and J.C. Campbell -- Adhesion Strength of CuCr Alloy Films to Polyimide / E.C. Ahn, Jin Yu and I.S. Park -- Advances in Liquid Encapsulated Chip-on-Board/MCM-L Technology / Dale L. Robinson and David B. Clegg.".
- catalog extent "xi, 284 p. :".
- catalog hasFormat "Electronic packaging materials science VIII.".
- catalog identifier "1558992936".
- catalog isFormatOf "Electronic packaging materials science VIII.".
- catalog isPartOf "Materials Research Society symposia proceedings ; v. 390.".
- catalog isPartOf "Materials Research Society symposium proceedings ; v. 390".
- catalog issued "1995".
- catalog issued "c1995.".
- catalog language "eng".
- catalog publisher "Pittsburgh, Pa. : Materials Research Society,".
- catalog relation "Electronic packaging materials science VIII.".
- catalog subject "Electronic packaging Congresses.".
- catalog subject "Electronic packaging Materials Congresses.".
- catalog subject "TK7870 .E5425 1995".
- catalog tableOfContents "Materials Research Society Symposium Proceedings -- Material Science and the Electronic Packaging Roadmap / C.A. Steidel, R.C. Sundahl and N. Grayeli -- Electronic Packaging Education in U.S. / Rao R. Tummala -- Electronics Packaging Materials Research at NIST / Michael A. Schen, G.T. Davis, F.I. Mopsik, W.L. Wu, W.E. Wallace, J.R. Manning, C.A. Handwerker and D.T. Read -- Thin Film Integral Capacitor Fabricated on a Polymer Dielectric for High Density Interconnect (HDI) Applications / Kyung W. Paik and Toh-Ming Lu -- Stress Concentrations in Electronic Packaging / Ravi Mahajan, Erdogan Madenci, Levent Ileri and Mark Thurston -- Determination of the Adhesive Strength of Film-Substrate Interfaces Using the Constant Depth Scratch Test / I. Dutta and J.C. Campbell -- Adhesion Strength of CuCr Alloy Films to Polyimide / E.C. Ahn, Jin Yu and I.S. Park -- Advances in Liquid Encapsulated Chip-on-Board/MCM-L Technology / Dale L. Robinson and David B. Clegg.".
- catalog title "Electronic packaging materials science VIII : symposium held April 17-20, 1995, San Francisco, California, U.S.A. / editors, Robert C. Sundahl ... [et al.].".
- catalog type "Conference proceedings. fast".
- catalog type "text".