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- catalog abstract "Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann - all leading CMP pioneers - provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.".
- catalog contributor b10292822.
- catalog contributor b10292823.
- catalog contributor b10292824.
- catalog created "1996.".
- catalog date "1996".
- catalog date "1996.".
- catalog dateCopyrighted "1996.".
- catalog description "1. Chemical Mechanical Planarization -- An Introduction -- 2. Historical Motivations for CMP -- 3. CMP Variables and Manipulations -- 4. Mechanical and Electrochemical Concepts for CMP -- 5. Oxide CMP Processes -- Mechanisms and Models -- 6. Tungsten and CMP Processes -- 7. Copper CMP -- 8. CMP of Other Materials and New CMP Applications -- 9. Post-CMP Cleanup -- Appendix. Problem Sets.".
- catalog description "Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann - all leading CMP pioneers - provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers.".
- catalog description "Includes bibliographical references and index.".
- catalog description "The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.".
- catalog extent "324 p. :".
- catalog hasFormat "Chemical mechanical planarization of microelectronic materials.".
- catalog identifier "0471138274 (cloth : alk. paper)".
- catalog isFormatOf "Chemical mechanical planarization of microelectronic materials.".
- catalog issued "1996".
- catalog issued "1996.".
- catalog language "eng".
- catalog publisher "New York : J. Wiley,".
- catalog relation "Chemical mechanical planarization of microelectronic materials.".
- catalog subject "621.3815/2 20".
- catalog subject "Chemical mechanical planarization.".
- catalog subject "Grinding and polishing.".
- catalog subject "Microelectronics Materials.".
- catalog subject "TK7871 .S77 1996".
- catalog tableOfContents "1. Chemical Mechanical Planarization -- An Introduction -- 2. Historical Motivations for CMP -- 3. CMP Variables and Manipulations -- 4. Mechanical and Electrochemical Concepts for CMP -- 5. Oxide CMP Processes -- Mechanisms and Models -- 6. Tungsten and CMP Processes -- 7. Copper CMP -- 8. CMP of Other Materials and New CMP Applications -- 9. Post-CMP Cleanup -- Appendix. Problem Sets.".
- catalog title "Chemical mechanical planarization of microelectronic materials / by Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann.".
- catalog type "text".