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- catalog abstract "The first comprehensive, in-depth guide to chip scale packaging (CSP), this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to: solve technical and design issues; find the most efficient, cost-effective CSP solutions for deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, and other major companies; and learn about CSP products under development.".
- catalog contributor b11143583.
- catalog contributor b11143584.
- catalog created "c1999.".
- catalog date "1999".
- catalog date "c1999.".
- catalog dateCopyrighted "c1999.".
- catalog description "Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to: solve technical and design issues; find the most efficient, cost-effective CSP solutions for deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, and other major companies; and learn about CSP products under development.".
- catalog description "Includes bibliographical references and index.".
- catalog description "The first comprehensive, in-depth guide to chip scale packaging (CSP), this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT).".
- catalog description "pt. 1. Flip Chip and Wire Bond for CSP. Ch. 1. Solder-Bumped Flip Chip and Wire-Bonding Chip on CSP Substrate -- pt. 2. Customized Leadframe Based CSPs. Ch. 2. Fujitsu's Small Outline No-Lead/C-Lead Package (SON/SOC). Ch. 3. Fujitsu's Bump Chip Carrier (BCC). Ch. 4. Fujitsu's MicroBGA and Quad Flat Nonleaded Package (QFN). Ch. 5. Hitachi Cable's Lead-on-Chip Chip Scale Package (LOC-CSP). Ch. 6. Hitachi Cable's Micro Stud Array Package (MSA). Ch. 7. LG Semicon's Bottom-Leaded Plastic Package (BLP). Ch. 8. TI Japan's Memory Chip Scale Package with LOC (MCSP) -- pt. 3. CSPs with Flexible Substrate. Ch. 9. 3M's Enhanced Flex CSP. Ch. 10. General Electric's Chip-on-Flex Chip Scale Package (COF-CSP).".
- catalog extent "xxii, 564 p. :".
- catalog identifier "0070383049".
- catalog isPartOf "Electronic packaging and interconnection series".
- catalog issued "1999".
- catalog issued "c1999.".
- catalog language "eng".
- catalog publisher "New York : McGraw-Hill,".
- catalog subject "621.3815 21".
- catalog subject "Integrated circuits Design and construction.".
- catalog subject "Microelectronic packaging.".
- catalog subject "TK7874 .L3167 1999".
- catalog tableOfContents "pt. 1. Flip Chip and Wire Bond for CSP. Ch. 1. Solder-Bumped Flip Chip and Wire-Bonding Chip on CSP Substrate -- pt. 2. Customized Leadframe Based CSPs. Ch. 2. Fujitsu's Small Outline No-Lead/C-Lead Package (SON/SOC). Ch. 3. Fujitsu's Bump Chip Carrier (BCC). Ch. 4. Fujitsu's MicroBGA and Quad Flat Nonleaded Package (QFN). Ch. 5. Hitachi Cable's Lead-on-Chip Chip Scale Package (LOC-CSP). Ch. 6. Hitachi Cable's Micro Stud Array Package (MSA). Ch. 7. LG Semicon's Bottom-Leaded Plastic Package (BLP). Ch. 8. TI Japan's Memory Chip Scale Package with LOC (MCSP) -- pt. 3. CSPs with Flexible Substrate. Ch. 9. 3M's Enhanced Flex CSP. Ch. 10. General Electric's Chip-on-Flex Chip Scale Package (COF-CSP).".
- catalog title "Chip scale package (CSP) : design, materials, processes, and applications / John H. Lau, Shi-Wei Ricky Lee.".
- catalog type "text".