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- 00103664 alternative "IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging".
- 00103664 contributor B69686.
- 00103664 contributor B69687.
- 00103664 created "2000.".
- 00103664 date "2000".
- 00103664 date "2000.".
- 00103664 dateCopyrighted "2000.".
- 00103664 description "Includes bibliographical references and index.".
- 00103664 extent "xiii, 339 p. :".
- 00103664 identifier "0780364503 (softbound edition)".
- 00103664 issued "2000".
- 00103664 issued "2000.".
- 00103664 language "eng".
- 00103664 publisher "Piscataway, NJ : IEEE,".
- 00103664 subject "621.381/046 22".
- 00103664 subject "Electronic packaging Congresses.".
- 00103664 subject "Materials Electric properties Congresses.".
- 00103664 subject "TK7870.15 .E3813 2000".
- 00103664 title "Electrical performance of electronic packaging : October 23-25, 2000, Radisson Resort & Spa Scottsdale, Scottsdale, Arizona / sponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging, and Manufacturing Technology Society.".
- 00103664 title "IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging".
- 00103664 type "text".