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- 00268788 alternative "1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing".
- 00268788 alternative "Poly'99".
- 00268788 alternative "Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing".
- 00268788 alternative "Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing".
- 00268788 contributor B85026.
- 00268788 contributor B85027.
- 00268788 contributor B85028.
- 00268788 created "c1999.".
- 00268788 date "1999".
- 00268788 date "c1999.".
- 00268788 dateCopyrighted "c1999.".
- 00268788 description "Includes bibliographical references and index.".
- 00268788 extent "viii, 283 p. :".
- 00268788 identifier "079181663X".
- 00268788 isPartOf "EEP (Series) ; vol. 27.".
- 00268788 isPartOf "EEP ; vol. 27".
- 00268788 issued "1999".
- 00268788 issued "c1999.".
- 00268788 language "eng".
- 00268788 publisher "New York, N.Y. : American Society of Mechanical Engineers,".
- 00268788 subject "621.381 21".
- 00268788 subject "Integrated circuits Reliability Congresses.".
- 00268788 subject "Microelectronic packaging Materials Congresses.".
- 00268788 subject "Photonics Materials Congresses.".
- 00268788 subject "Polymeric composites Congresses.".
- 00268788 subject "Polymers Congresses.".
- 00268788 subject "TK7871.15.P6 W68 1999".
- 00268788 title "1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing".
- 00268788 title "Poly'99".
- 00268788 title "Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing".
- 00268788 title "Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, presented at Hotel Concorde Saint-Lazare, December 12-15, 1999, Paris, France / sponsored by the Electrical and Electronic Packaging Division, ASME, in cooperation with IEEE Components, Packaging and Manufacturing Technology (CPMT) Society ... [et al.] ; edited by Ephraim Suhir ... [et al.].".
- 00268788 title "Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing".
- 00268788 type "text".