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- 2001030752 contributor B8933306.
- 2001030752 contributor B8933307.
- 2001030752 created "c2001.".
- 2001030752 date "2001".
- 2001030752 date "c2001.".
- 2001030752 dateCopyrighted "c2001.".
- 2001030752 extent "xxiii, 565 p. :".
- 2001030752 identifier "0071363270".
- 2001030752 identifier 2001030752.html.
- 2001030752 identifier 2001030752.html.
- 2001030752 identifier 2001030752.html.
- 2001030752 issued "2001".
- 2001030752 issued "c2001.".
- 2001030752 language "eng".
- 2001030752 publisher "New York : McGraw-Hill,".
- 2001030752 subject "621.381/046 21".
- 2001030752 subject "Integrated circuits Design and construction Cost control.".
- 2001030752 subject "Microelectronic packaging.".
- 2001030752 subject "Printed circuits.".
- 2001030752 subject "Semiconductors Junctions.".
- 2001030752 subject "TK7874 .L31684 2001".
- 2001030752 title "Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.".
- 2001030752 type "text".