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- 2001031713 contributor B8934395.
- 2001031713 created "c2002.".
- 2001031713 date "2002".
- 2001031713 date "c2002.".
- 2001031713 dateCopyrighted "c2002.".
- 2001031713 description "Includes bibliographical references and index.".
- 2001031713 extent "ix, 270 p. :".
- 2001031713 identifier "0750672188 (alk. paper)".
- 2001031713 identifier 2001031713.html.
- 2001031713 identifier 2001031713.html.
- 2001031713 issued "2002".
- 2001031713 issued "c2002.".
- 2001031713 language "eng".
- 2001031713 publisher "Boston : Newnes,".
- 2001031713 subject "621.381/046 21".
- 2001031713 subject "Electric connectors.".
- 2001031713 subject "Electronic apparatus and appliances Design and construction.".
- 2001031713 subject "Electronic packaging.".
- 2001031713 subject "Solder and soldering.".
- 2001031713 subject "TK7836 .L43 2002".
- 2001031713 title "Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee.".
- 2001031713 type "text".