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- 2002028782 contributor B9222238.
- 2002028782 contributor B9222239.
- 2002028782 created "c2002.".
- 2002028782 date "2002".
- 2002028782 date "c2002.".
- 2002028782 dateCopyrighted "c2002.".
- 2002028782 description "Includes bibliographical references and index.".
- 2002028782 extent "xiv, 229 p. :".
- 2002028782 identifier "1402071930".
- 2002028782 identifier 2002028782-d.html.
- 2002028782 identifier 2002028782-t.html.
- 2002028782 issued "2002".
- 2002028782 issued "c2002.".
- 2002028782 language "eng".
- 2002028782 publisher "Boston : Kluwer Academic Publishers,".
- 2002028782 subject "621.3815/2 21".
- 2002028782 subject "Chemical mechanical planarization.".
- 2002028782 subject "Grinding and polishing.".
- 2002028782 subject "Interconnects (Integrated circuit technology)".
- 2002028782 subject "Semiconductors Polishing.".
- 2002028782 subject "TK7874.53 .B67 2002".
- 2002028782 title "Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses : fundamental mechanisms and application to IC interconnect technology / by Christopher L. Borst, William N. Gill, Ronald J. Gutmann.".
- 2002028782 type "text".