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- 2002034095 contributor B9227704.
- 2002034095 created "c2003.".
- 2002034095 date "2003".
- 2002034095 date "c2003.".
- 2002034095 dateCopyrighted "c2003.".
- 2002034095 description "Includes bibliographical references and index.".
- 2002034095 extent "xix, 338 p. :".
- 2002034095 identifier "0792376765".
- 2002034095 identifier 2002034095-d.html.
- 2002034095 identifier 2002034095.html.
- 2002034095 isPartOf "Emerging technology in advanced packaging series ; 1".
- 2002034095 issued "2003".
- 2002034095 issued "c2003.".
- 2002034095 language "eng".
- 2002034095 publisher "Boston : Kluwer Academic Publishers,".
- 2002034095 subject "621.381/046 21".
- 2002034095 subject "Chip scale packaging.".
- 2002034095 subject "Flexible printed circuits.".
- 2002034095 subject "Microelectronic packaging.".
- 2002034095 subject "Multichip modules (Microelectronics)".
- 2002034095 subject "TK7870.15 .F65 2003".
- 2002034095 title "Foldable flex and thinned silicon multichip packaging technology / edited by John W. Balde.".
- 2002034095 type "text".