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- 2002038928 contributor B9231831.
- 2002038928 contributor B9231832.
- 2002038928 created "2002.".
- 2002038928 date "2002".
- 2002038928 date "2002.".
- 2002038928 dateCopyrighted "2002.".
- 2002038928 description "Includes bibliographical references and index.".
- 2002038928 extent "xx, 185 p. :".
- 2002038928 identifier "1402073305 (alk. paper)".
- 2002038928 identifier 2002038928.html.
- 2002038928 isPartOf "Kluwer international series in engineering and computer science ; SECS 719".
- 2002038928 issued "2002".
- 2002038928 issued "2002.".
- 2002038928 language "eng".
- 2002038928 publisher "Boston, Mass. : Kluwer Academic Publishers,".
- 2002038928 subject "621.381/046 21".
- 2002038928 subject "ANSYS (Computer system)".
- 2002038928 subject "Electronic packaging Computer-aided design.".
- 2002038928 subject "Metals Fatigue.".
- 2002038928 subject "Service life (Engineering) Forecasting.".
- 2002038928 subject "Solder and soldering Quality control.".
- 2002038928 subject "TK7870.15 .M32 2002".
- 2002038928 title "Fatigue life prediction of solder joints in electronic packages with ANSYS / Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.".
- 2002038928 type "text".