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- 2002111865 contributor B9257471.
- 2002111865 contributor B9257472.
- 2002111865 contributor B9257473.
- 2002111865 created "c2002.".
- 2002111865 date "2002".
- 2002111865 date "c2002.".
- 2002111865 dateCopyrighted "c2002.".
- 2002111865 description "Includes bibliographical references and indexes.".
- 2002111865 extent "vii, 294 p. :".
- 2002111865 identifier "1566773601".
- 2002111865 isPartOf "Proceedings (Electrochemical Society) ; v. 2001-27.".
- 2002111865 isPartOf "Proceedings ; v. 2001-27".
- 2002111865 issued "2002".
- 2002111865 issued "c2002.".
- 2002111865 language "eng".
- 2002111865 publisher "Pennington, NJ : Electrochemical Society,".
- 2002111865 subject "Microelectromechanical systems Design and construction Congresses.".
- 2002111865 subject "Semiconductor wafers Congresses.".
- 2002111865 subject "Semiconductors Bonding Congresses.".
- 2002111865 subject "TK7871.85 I5838 2001".
- 2002111865 title "Semiconductor wafer bonding : science, technology, and applications VI : proceedings of the international symposium / editors, H. Baumgart ... [et al.] ; sponsoring Division: Electronics.".
- 2002111865 type "text".