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- 2002113552 alternative "EMAP 2002".
- 2002113552 alternative "Proceedings of International Symposium on Electronic Materials and Packaging".
- 2002113552 alternative "Proceedings, International Symposium on Electronic Materials and Packaging".
- 2002113552 contributor B9258830.
- 2002113552 contributor B9258831.
- 2002113552 created "c2002.".
- 2002113552 date "2002".
- 2002113552 date "c2002.".
- 2002113552 dateCopyrighted "c2002.".
- 2002113552 description "Includes bibliographical references.".
- 2002113552 extent "xv, 498 p. :".
- 2002113552 identifier "078037682X (Softbound ed.)".
- 2002113552 issued "2002".
- 2002113552 issued "c2002.".
- 2002113552 language "eng".
- 2002113552 publisher "Piscataway, NJ : IEEE,".
- 2002113552 subject "621.381/046 22".
- 2002113552 subject "Electronic packaging Congresses.".
- 2002113552 subject "Electronics Materials Congresses.".
- 2002113552 subject "TK7871 .I588 2002".
- 2002113552 title "EMAP 2002".
- 2002113552 title "Proceedings of International Symposium on Electronic Materials and Packaging".
- 2002113552 title "Proceedings of the 4th International Symposium on Electronic Materials and Packaging : December 4-6, 2002, Kaosiung, Taiwan / organized by I-Shou University in collaboration with IEEE Component, Packaging, and Manufacturing Technology, Taipei Chapter.".
- 2002113552 title "Proceedings, International Symposium on Electronic Materials and Packaging".
- 2002113552 type "text".