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- 2002277508 alternative "2001 HD International Conference on High-Density Interconnect and Systems Packaging".
- 2002277508 alternative "HD International Conference on High-Density Interconnect and Systems Packaging".
- 2002277508 alternative "High density interconnect and systems packaging".
- 2002277508 alternative "High-density interconnect and systems packaging".
- 2002277508 alternative "International Conference on High-Density Interconnect and Systems Packaging".
- 2002277508 contributor B9274856.
- 2002277508 contributor B9274857.
- 2002277508 created "c2001.".
- 2002277508 date "2001".
- 2002277508 date "c2001.".
- 2002277508 dateCopyrighted "c2001.".
- 2002277508 description "Includes bibliographical references and index.".
- 2002277508 extent "x, 380 p. :".
- 2002277508 identifier "0819441392".
- 2002277508 identifier "0930815637".
- 2002277508 isPartOf "Proceedings of SPIE--the International Society for Optical Engineering ; v. 4428.".
- 2002277508 isPartOf "SPIE proceedings series ; v. 4428".
- 2002277508 issued "2001".
- 2002277508 issued "c2001.".
- 2002277508 language "eng".
- 2002277508 publisher "Washington, DC : IMAPS ; [Bellingham, Wash.] : Published in cooperation with SPIE,".
- 2002277508 subject "621.381/046 21".
- 2002277508 subject "Integrated circuits Design and construction Congresses.".
- 2002277508 subject "Microelectromechanical systems Congresses.".
- 2002277508 subject "Microelectronic packaging Congresses.".
- 2002277508 subject "TK7874 .I5684 2001".
- 2002277508 title "2001 HD International Conference on High-Density Interconnect and Systems Packaging".
- 2002277508 title "HD International Conference on High-Density Interconnect and Systems Packaging".
- 2002277508 title "High density interconnect and systems packaging".
- 2002277508 title "High-density interconnect and systems packaging".
- 2002277508 title "International Conference on High-Density Interconnect and Systems Packaging".
- 2002277508 title "Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California / sponsored by IMAPS--International Microelectronics and Packaging Society [and] CMP Media.".
- 2002277508 type "text".