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- 2003059075 contributor B9550312.
- 2003059075 created "c2004.".
- 2003059075 date "2004".
- 2003059075 date "c2004.".
- 2003059075 dateCopyrighted "c2004.".
- 2003059075 description "Includes bibliographical references.".
- 2003059075 extent "x, 425 p. :".
- 2003059075 identifier "3540431810 (alk. paper)".
- 2003059075 identifier 2003059075-d.html.
- 2003059075 identifier 2003059075-t.html.
- 2003059075 isPartOf "Springer series in materials science ; v. 69".
- 2003059075 issued "2004".
- 2003059075 issued "c2004.".
- 2003059075 language "eng".
- 2003059075 publisher "Berlin ; New York : Springer,".
- 2003059075 subject "621.3815/2 22".
- 2003059075 subject "Chemical mechanical planarization.".
- 2003059075 subject "Grinding and polishing.".
- 2003059075 subject "Semiconductors Materials.".
- 2003059075 subject "TK7871.85 .C475 2004".
- 2003059075 title "Chemical-mechanical planarization of semiconductor materials / M.R. Oliver (ed.).".
- 2003059075 type "text".