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- 2003109518 contributor B9571311.
- 2003109518 contributor B9571312.
- 2003109518 contributor B9571313.
- 2003109518 created "2003.".
- 2003109518 date "2003".
- 2003109518 date "2003.".
- 2003109518 dateCopyrighted "2003.".
- 2003109518 description "Includes bibliographical references and indexes.".
- 2003109518 extent "x, 424 p. :".
- 2003109518 identifier "1566773938".
- 2003109518 isPartOf "Proceedings ; v. 2003-13".
- 2003109518 issued "2003".
- 2003109518 issued "2003.".
- 2003109518 language "eng".
- 2003109518 publisher "Pennington, NJ : Electrochemical Society,".
- 2003109518 subject "Plasma etching Congresses.".
- 2003109518 subject "TK7872.T55 I57 2003".
- 2003109518 subject "Thin film devices Design and construction Congresses.".
- 2003109518 subject "Thin films Congresses.".
- 2003109518 title "Thin film materials, processes, and reliability : plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium / [editor, G. S. Mathad ; sponsoring divisions, Dielectric Science and Technology, Electronics.".
- 2003109518 type "text".