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- 2003110702 contributor B9572236.
- 2003110702 contributor B9572237.
- 2003110702 contributor B9572238.
- 2003110702 created "c2003.".
- 2003110702 date "2003".
- 2003110702 date "c2003.".
- 2003110702 dateCopyrighted "c2003.".
- 2003110702 description "Includes bibliographical references and indexes.".
- 2003110702 extent "ix, 276 p. :".
- 2003110702 identifier "1566773903".
- 2003110702 isPartOf "Proceedings (Electrochemical Society) v. 2003-10.".
- 2003110702 isPartOf "Proceedings ; v. 2003-10".
- 2003110702 issued "2003".
- 2003110702 issued "c2003.".
- 2003110702 language "eng".
- 2003110702 publisher "Pennington, N.J. : Electrochemical Society,".
- 2003110702 subject "Copper Congresses.".
- 2003110702 subject "Dielectric films Congresses.".
- 2003110702 subject "Electroplating Congresses.".
- 2003110702 subject "Integrated circuits Materials Congresses.".
- 2003110702 subject "TK7874 I47355 2003".
- 2003110702 title "Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II : proceedings of the international symposium / editor, G.S. Mathad ; assistant editors, V. Bakshi ...[et al.]".
- 2003110702 type "text".