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- 2003115444 contributor B9575951.
- 2003115444 contributor B9575952.
- 2003115444 contributor B9575953.
- 2003115444 created "c2004.".
- 2003115444 date "2004".
- 2003115444 date "c2004.".
- 2003115444 dateCopyrighted "c2004.".
- 2003115444 description "Includes bibliographical references and index.".
- 2003115444 extent "ix, 390 p. :".
- 2003115444 identifier "1566774020".
- 2003115444 identifier 2003115444.html.
- 2003115444 isPartOf "Proceedings (Electrochemical Society) ; 2003-19".
- 2003115444 isPartOf "Proceedings / Electrochemical Society ; 2003-19".
- 2003115444 issued "2004".
- 2003115444 issued "c2004.".
- 2003115444 language "eng".
- 2003115444 publisher "Pennington, NJ : Electrochemical Society,".
- 2003115444 subject "621.3815/2 22".
- 2003115444 subject "Microelectromechanical systems Design and construction Congresses.".
- 2003115444 subject "Semiconductor wafers Congresses.".
- 2003115444 subject "Semiconductors Bonding Congresses.".
- 2003115444 subject "TK7871.85 I5838 2003".
- 2003115444 title "Semiconductor wafer bonding VII : science, technology, and applications : proceedings of the international symposium / S. Bengtsson ... [et al.], editors.".
- 2003115444 type "text".