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- 2003271418 contributor B9585388.
- 2003271418 contributor B9585389.
- 2003271418 created "c2002.".
- 2003271418 date "2002".
- 2003271418 date "c2002.".
- 2003271418 dateCopyrighted "c2002.".
- 2003271418 description "Includes bibliographical references and index.".
- 2003271418 extent "xiii, 572 p. :".
- 2003271418 identifier "0791836487".
- 2003271418 isPartOf "EPP (Series) ; v. 2.".
- 2003271418 isPartOf "EPP ; vol. 2".
- 2003271418 issued "2002".
- 2003271418 issued "c2002.".
- 2003271418 language "eng".
- 2003271418 publisher "New York : American Society of Mechanical Engineers,".
- 2003271418 subject "Electronic packaging Congresses.".
- 2003271418 subject "Integrated circuits Wafer-scale integration Congresses.".
- 2003271418 subject "Microelectromechanical systems Congresses.".
- 2003271418 subject "Microelectronic packaging Congresses.".
- 2003271418 subject "Nanotechnology Congresses.".
- 2003271418 subject "Photonics Congresses.".
- 2003271418 subject "Surface mount technology Congresses.".
- 2003271418 subject "TK7870.15 .E39 2002".
- 2003271418 title "Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana / sponsored by the Electronic and Photonic Packaging Division, ASME.".
- 2003271418 type "text".