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- 2004042860 contributor B9845690.
- 2004042860 created "c2004.".
- 2004042860 date "2004".
- 2004042860 date "c2004.".
- 2004042860 dateCopyrighted "c2004.".
- 2004042860 description "Includes bibliographical references and index.".
- 2004042860 extent "x, 260 p. :".
- 2004042860 identifier "0071428291 (acid-free paper)".
- 2004042860 identifier 2004042860.html.
- 2004042860 identifier 2004042860.html.
- 2004042860 identifier 2004042860.html.
- 2004042860 issued "2004".
- 2004042860 issued "c2004.".
- 2004042860 language "eng".
- 2004042860 publisher "New York : McGraw-Hill,".
- 2004042860 subject "621.381/046 22".
- 2004042860 subject "Microelectronic packaging.".
- 2004042860 subject "Multichip modules (Microelectronics).".
- 2004042860 subject "TK7874 .A72 2004".
- 2004042860 title "Area array packaging processes : for BGA, Flip Chip, and CSP / Ken Gilleo, editor.".
- 2004042860 type "text".