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- 2004046626 contributor B9850087.
- 2004046626 created "2004.".
- 2004046626 date "2004".
- 2004046626 date "2004.".
- 2004046626 dateCopyrighted "2004.".
- 2004046626 description "Includes bibliographical references and index.".
- 2004046626 extent "xv, 499 p. :".
- 2004046626 identifier "3540210490 (alk. paper)".
- 2004046626 identifier 2004046626-d.html.
- 2004046626 identifier 2004046626-t.html.
- 2004046626 isPartOf "Springer series in materials science, 0933-033X".
- 2004046626 issued "2004".
- 2004046626 issued "2004.".
- 2004046626 language "eng".
- 2004046626 publisher "Berlin ; New York : Springer,".
- 2004046626 subject "621.3815/2 22".
- 2004046626 subject "Semiconductor wafers.".
- 2004046626 subject "Semiconductors Bonding.".
- 2004046626 subject "TK7871.85 .W27 2004".
- 2004046626 title "Wafer bonding : applications and technology / M. Alexe, U. Gösele (eds.).".
- 2004046626 type "text".